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building block. PEH4010 Datasheet |
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PEH4010 – Full bridge building block
Rev. B / February, 2019
GENERAL DESCRIPTION
These modules are designed for the low-voltage labora-
tory implementation of multilevel converters. Versatile
power interfaces allow to easily configure the modules
for both half- or full-bridge operation. The design is tai-
lored for 19’’ rack integration with simple interconnec-
tions and direct connection to a BoomBox, or any other
control platform.
Direct access to the gating signals is offered using opti-
cal fiber inputs, while embedded measurement circuits
provide direct analog outputs related to the capacitor
voltage and one output current using galvanically-iso-
lated sensors.
The modules are well suited for any kind of PWM opera-
tion from 0 Hz to 50 kHz and current ratings up to 50 A.
The main limitation being the power envelope of the
heatsinks, which is limited to approximately 20 W with
no airflow and about 30 W with a 1 m/s airflow.
Overvoltage, over-current and over-temperature pro-
tections are also integrated on the board for safer use
in R&D applications. Besides, these protections are user-
programmable through a simple onboard microcon-
troller and a CPLD.
Finally, the possibility to use alternative or customized
mezzanine boards enables the compatibility with future
developments and onboard data processing.
TYPICAL APPLICATIONS
The modules are ideally suited for the implementa-
tion of low-voltage prototypes of multilevel converters
such as Modular Multilevel Converters (MMC), Cascaded
H-bridge (CHB) systems or any similar topology.
Nevertheless, they can also be easily combined to build
up simple DC-DC converters, Dual-Active Bridges (DHB),
resonant converters, back-to-back systems, etc.
KEY FEATURES AND SPECIFICATIONS
–– 10 A / 400 V maximum ratings, limited by losses
–– 600 V / 50 A IGBTs
–– 230 A maximum current (1 ms)
–– 2 x 20 W TDP enveloppe
–– Isolated TO247 transistor packages
–– 0-1.35 mF / 400 V DC bus, depending on configuration
–– Up to 50 kHz switching frequency
–– ± 3kV galvanic isolation (1 s) / ±560 V (permanent)
–– 4 optical inputs / 1 optical output
–– 2 analog outputs
–– Single +5 V power supply
–– Embedded voltage and current measurement
–– Over voltage/current/temperature protection
–– User-configurable CPLD
–– 100 x 260 mm Eurocard form factor
–– Forward compatible with imperix RealSync technol-
ogy and the related mezzanine board
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GENERAL SCHEMATIC
5V0 5V0
G0
VDD
5V0 5V0
G1
VDD
5V0 5V0
G2
VDD
5V0 5V0
G3
5V0
4x
GND
T0... T3
IA
VDC
Fig. 1. Simplified schematic of the power stage of the H-bridge module. Embedded logic circuits and I/O connectors not shown.
MAIN COMPONENTS
Component
Power switches
Capacitors
Drivers
Isolated DC/DC Converters
Current sensor
Voltage sensor
Heatsinks
CPLD
Microcontrollers
Devices
4x IXYS IXGR 48N60 C3D1
9x United Chemicon SMQ 0-150uF
4x Avago HCPL-3140
3x Recom RBM0515S
1x Allegro ACS709-20
1x Resistive divider + Texas Instruments AMC1200
2x Fischer SK 487/84
1x Xilinx XC9536XL-10VQG44C
2x Microchip PIC24F04KA201
Main specifications
See below or device datasheet
400V, IRIPPLE > 1.1A per capacitor (option)
0.4 A, 10 kV/us, VIORM = 630V
5-15 V, 1W, VIORM = 1.1kV
±37.5A, 120kHz, ±2% accuracy
60kHz, ±0.5% accuracy
84 x 52.3 x 28 mm, 2.5 K/W without airflow
10ns, 36 macrocells
16bits, 16Mhz, 9x 10-bit ADC @ 500ksps
ABSOLUTE MAXIMUM RATINGS
Parameter
Maximum DC bus voltage 1
Maximum continuous leg A / leg B current 2
Maximum DC bus ripple current (at 100 Hz) 3
Maximum working isolation voltage
Highest allowable isolation voltage (1 s)
Supply voltage
Symbol
VDC
IA/B,max
IRIPPLE
VIORM
VIOTM
5V0
12V 4
Highest allowable junction temperature
TJ(max)
Test conditions
TJ = 25°C
Min.
Typ.
Max.
Unit
-
400
-
V
56
A
-
10
-
A
-
560
-
VPEAK
-
3.0
-
kVPEAK
4.2
5.0
5.8
V
4.5
12.0
14.0
V
-
150
-
°C
1 The maximum DC bus voltage is defined by the speci-
fications of the bus capacitors. Therefore, as for any alu-
minium electrolytic capacitors, few short-term over-
voltages can be tolerated, provided that they involve
limited amounts of energy.
3 The maximum ripple current is defined by the equiva-
lent series resistance (ESR) of the capacitors and relates
to Joule losses and lifetime considerations. Therefore,
this value can be exceeded, provided that the operat-
ing temperature of the capacitors remain low.
2 In cold conditions, the maximum operating current is
limited by the power semiconductors. Otherwise, the
current rating of the module is limited by the power
envelope of the heatsinks (about 20 W without airflow).
This typically restricts the RMS value of the phase-leg
current to about 15 A for a switching frequency of 10kHz.
4 The 12V supply is optional, as it is entirely independent
from the module and serves only to supply optional
cooling fans that can be mounted on the heatsinks.
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POWER CHARACTERISTICS
Parameter
IGBT blocking voltage
IGBT continuous collector/diode current
IGBT pulse collector/diode current (1 ms)
IGBT saturation voltage
Diode forward voltage
Reverse recovery current
Reverse recovery delay
Thermal resistance junction-to-pad
Thermal resistance heatsink-to-air
Turn-on losses (inductive load)
Turn-off losses (inductive load)
Case-to-heasink isolation voltage
Symbol
ICES
IC25
IC110
ICM
VCE(sat)
VF
IRRM
tRR
RthJP
RthSA
Eon
Eoff
VISO
TJ = 25 to 150°C
TJ = 25°C
TJ = 110°C
TJ = 25°C
IC = 15A, TJ = 25°C
IC = 15A, TJ = 125°C
IF = 15A, TJ = 25°C, VGE = 0V
IF = 15A, TJ = 125°C, VGE = 0V
IF = 30A, VR = 100V, di/dt = -100A/μs
IF = 1A, VR = 30V, di/dt = -100A/μs
IC = 15A, VCE = 200V, TJ = 25°C
IC = 15A, VCE = 200V, TJ = 125°C
IC = 15A, VCE = 200V, TJ = 25°C
IC = 15A, VCE = 200V, TJ = 125°C
50Hz, 1min
Min.
Typ.
Max.
Unit
-
600
-
V
-
56
-
A
-
26
-
A
-
230
-
A
-
2.1
-
V
-
1.3
-
V
-
2.2
-
V
-
1.5
-
V
-
4
-
A
-
100
-
ns
-
-
1.5
°C/W
-
2.5
-
°C/W
-
150
-
μJ
-
250
-
μJ
-
80
-
μJ
-
130
-
μJ
2.5
kV
Assuming a phase-leg current of 8 ARMS and a switching
frequency of 10 kHz for each device, these characteristics
lead for each phase-leg to approximately :
»» conduction losses : 20 W hot / 35 W cold
»» switching losses : 4.2 W hot / 2.7 W cold
The total thermal resistance junction-to-air is approxi-
mately 4.0 to 4.5 °C/W, leading to a junction tempera-
ture of typically 120 to 130°C for the above-mentioned
operating conditions and losses, assuming an ambient
air temperature of 25°C.
CURRENT MEASUREMENT CHARACTERISTICS
Parameter
Symbol Note
Min.
Optimized accuracy range
IOPT
-
Linear range 5
IFS
-
Nominal sensitivity
G
Including a x2 gain on the Mezzanine - 72.0
Total output error 6
Bandwidth
Measurable slope
GERR
TA = 25°to 100 °C
-
f3dB
-
dI/dt
-
Maximum working isolation voltage
VIORM
-
Typ.
±20
±37.5
- 74.0
±0.5
120
6
390
Max.
-
-
- 77.2
±2.0
-
-
-
Unit
A
A
mV/A
%
kHz
A/μs
VDC
VOLTAGE MEASUREMENTS CHARACTERISTICS
Parameter
Symbol Note
Min.
Typ.
Max.
Unit
Measurement range
VOPT
0.0
-
400
V
Maximum measurement range 5
VFS
0.0
-
450
V
Nominal sensitivity
G
Including a x2 gain on the Mezzanine -
- 8.9
-
mV/V
Uncalibrated sensitivity error
Gain error over temperature
Bandwidth
Measurable slope
GERR
25°to 125 °C, including resistive divider
±2.0
%
GERR,t
TA = 25°to 100 °C
±0.1
%
f3dB
-
25
-
kHz
dV/dt
-
220
-
V/μs
Maximum working isolation voltage
VIORM
-
1140
-
VDC
5 The integrated current and voltage measurements are
isolated onboard, as depicted by Fig. 1. The measured
values are available as differential signals on the mezza-
nine connectors, with voltages ranging in the interval
between 0 and 3.3 V. In case imperix ModuLink mezza-
nine are used, the latter feature an integrated x2 gain.
6 When calibrated under stabilized operating tempera-
ture conditions, superior performance can be achieved.
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