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Package Outline. PG-LQFP-144-4 Datasheet

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Package Outline. PG-LQFP-144-4 Datasheet
















PG-LQFP-144-4 Outline. Datasheet pdf. Equivalent













Part

PG-LQFP-144-4

Description

Package Outline



Feature


Additional Information, DS3, Nov. 2008 R ecommendations for Printed Circuit Boar d Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-3/ PG-L QFP-144-4 Packages Edition 2008-11 Pub lished by Infineon Technologies AG 8172 6 München, Germany © 2008 Infineon Te chnologies AG All Rights Reserved. Lega l Disclaimer The information given in t his document shall i.
Manufacture

Infineon

Datasheet
Download PG-LQFP-144-4 Datasheet


Infineon PG-LQFP-144-4

PG-LQFP-144-4; n no event be regarded as a guarantee of conditions or characteristics. With re spect to any examples or hints given he rein, any typical values stated herein and/or any information regarding the ap plication of the device, Infineon Techn ologies hereby disclaims any and all wa rranties and liabilities of any kind, i ncluding without limitation, warranties of non-infringeme.


Infineon PG-LQFP-144-4

nt of intellectual property rights of an y third party. Information For further information on technology, delivery ter ms and conditions and prices, please co ntact the nearest Infineon Technologies Office (www.infineon.com). Warnings Du e to technical requirements, components may contain dangerous substances. For information on the types in question, p lease contact the .


Infineon PG-LQFP-144-4

nearest Infineon Technologies Office. In fineon Technologies components may be u sed in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be ex pected to cause the failure of that lif e-support device or system or to affect the safety or effectiveness of that de vice or system. Li.





Part

PG-LQFP-144-4

Description

Package Outline



Feature


Additional Information, DS3, Nov. 2008 R ecommendations for Printed Circuit Boar d Assembly of Infineon PG-LQFP-64-6, -8 -11/ PG-LQFP-100-2/PG-LQFP-100-3/ PG-L QFP-144-4 Packages Edition 2008-11 Pub lished by Infineon Technologies AG 8172 6 München, Germany © 2008 Infineon Te chnologies AG All Rights Reserved. Lega l Disclaimer The information given in t his document shall i.
Manufacture

Infineon

Datasheet
Download PG-LQFP-144-4 Datasheet




 PG-LQFP-144-4
Additional Information, DS3, Nov. 2008
Recommendations for Printed
Circuit Board Assembly of
Infineon PG-LQFP-64-6, -8 -11/
PG-LQFP-100-2/PG-LQFP-100-3/
PG-LQFP-144-4 Packages




 PG-LQFP-144-4
Edition 2008-11
Published by
Infineon Technologies AG
81726 München, Germany
© 2008 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.




 PG-LQFP-144-4
Assembly & Interconnect Technology
1
2
2.1
2.1.1
2.1.2
2.1.3
2.2
2.3
2.4
2.5
2.6
3
3.1
3.2
3.3
3.4
3.5
4
4.1
4.2
4.3
4.4
4.5
4.6
4.7
5
5.1
5.2
5.3
5.4
6
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package Handling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ESD Protective Measures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ESD Protective Measures in the Workplace . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Equipment for Personal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Production Installations and Processing Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing of Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Moisture-Sensitive Components (MSL Classification) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Storage and Transportation Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Handling Damage and Contamination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Component Solderability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Printed Circuit Board (PCB) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
General Remarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
PCB Pad Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Solder Mask Layer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Vias in Thermal Pad . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
PCB Pad Finishes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Board Assembly . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
General Remarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Solder Stencil . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Component Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Tooling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Device Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Site Redressing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Reassembly and Reflow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
List of References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Additional Information
3
DS3, 2008-11




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