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high-side switch. MC08XS6421DEK Datasheet

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high-side switch. MC08XS6421DEK Datasheet
















MC08XS6421DEK switch. Datasheet pdf. Equivalent













Part

MC08XS6421DEK

Description

high-side switch



Feature


NXP Semiconductors Data sheet: Technical Data Document Number: MC12XS6D4 Rev. 6.0, 1/2021 Dual 8.0 mOhm and dual 21 mOhm high-side switch MC08XS6421BEK; M C08XS6421CEK; MC08XS6421DEK The 12XS6 is the latest SMARTMOS achievement in a utomotive lighting drivers. It belongs to an expanding family that helps to co ntrol and diagnose incandescent lamps a nd light-emitting .
Manufacture

NXP

Datasheet
Download MC08XS6421DEK Datasheet


NXP MC08XS6421DEK

MC08XS6421DEK; diodes (LEDs) with enhanced precision. I t combines flexibility through daisy ch ainable SPI 5.0 MHz, extended digital a nd analog feedback, safety, and robustn ess. Output edge shaping helps to impro ve electromagnetic performance. To avoi d shutting off the device upon inrush c urrent, while still being able to close ly track the load current, a dynamic ov ercurrent threshol.


NXP MC08XS6421DEK

d profile is featured. Current of each c hannel can be sensed with a programmabl e sensing ratio. Whenever communication with the external microcontroller is l ost, the device enters a fail operation mode, but remains operational, control lable, and protected. This new generati on of high-side switch products family 12XS6 facilitates ECU design due to com patible MCU softwa.


NXP MC08XS6421DEK

re and PCB foot prints for each device v ariant. QUAD HIGH-SIDE SWITCH BEK and DEK SUFFIX (PB-FREE) 98ASA00368D 32-PI N SOICW-EP CEK SUFFIX (PB-FREE) 98ASA0 0894D 32-PIN SOICW-EP Features • Dua l 8.0 mΩ and dual 21 mΩ high-side swi tches with high transient current capab ility • 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including PWM duty-cycle.





Part

MC08XS6421DEK

Description

high-side switch



Feature


NXP Semiconductors Data sheet: Technical Data Document Number: MC12XS6D4 Rev. 6.0, 1/2021 Dual 8.0 mOhm and dual 21 mOhm high-side switch MC08XS6421BEK; M C08XS6421CEK; MC08XS6421DEK The 12XS6 is the latest SMARTMOS achievement in a utomotive lighting drivers. It belongs to an expanding family that helps to co ntrol and diagnose incandescent lamps a nd light-emitting .
Manufacture

NXP

Datasheet
Download MC08XS6421DEK Datasheet




 MC08XS6421DEK
NXP Semiconductors
Data sheet: Technical Data
Document Number: MC12XS6D4
Rev. 6.0, 1/2021
Dual 8.0 mOhm and dual 21 mOhm
high-side switch
MC08XS6421BEK; MC08XS6421CEK;
MC08XS6421DEK
The 12XS6 is the latest SMARTMOS achievement in automotive lighting drivers.
It belongs to an expanding family that helps to control and diagnose incandescent
lamps and light-emitting diodes (LEDs) with enhanced precision. It combines
flexibility through daisy chainable SPI 5.0 MHz, extended digital and analog
feedback, safety, and robustness.
Output edge shaping helps to improve electromagnetic performance. To avoid
shutting off the device upon inrush current, while still being able to closely track
the load current, a dynamic overcurrent threshold profile is featured. Current of
each channel can be sensed with a programmable sensing ratio. Whenever
communication with the external microcontroller is lost, the device enters a fail
operation mode, but remains operational, controllable, and protected.
This new generation of high-side switch products family 12XS6 facilitates ECU
design due to compatible MCU software and PCB foot prints for each device
variant.
QUAD HIGH-SIDE SWITCH
BEK and DEK SUFFIX
(PB-FREE)
98ASA00368D
32-PIN SOICW-EP
CEK SUFFIX
(PB-FREE)
98ASA00894D
32-PIN SOICW-EP
Features
• Dual 8.0 mΩ and dual 21 mΩ high-side switches with high transient current
capability
• 16-bit 5.0 MHz SPI control of overcurrent profiles, channel control including
PWM duty-cycles, output On and Off openload detections, thermal shut-down
and prewarning, and fault reporting
• Output current monitoring with programmable synchronization signal and
battery voltage feedback
• Limp home mode
• External smart power switch control
• Operating voltage is 7.08 V to 18 V with sleep current < 5.0 µA, extended
mode from 6.08 V to 28 V
• -16 V reverse polarity and ground disconnect protections
• Compatible PCB foot print and SPI software driver among the family
Applications
• Low-voltage automotive lighting
• Halogen lamps
• Incandescent bulbs
• Light-emitting diodes (LEDs)
• HID Xenon ballasts
VBAT
VBAT VCC
5.0 V
Regulator
GND
VCC
Main
MCU
GND
SO
CSB
SCLK
SI
RSTB
CLK
A/D1
TRG1
PORT
PORT
PORT
PORT
PORT
A/D2
08XS6421
VCC
SI
CSB
SCLK
SO
RSTB
CLK
CSNS
SYNCB
LIMP
IN1
IN2
IN3
IN4
GND
VBAT
CP
OUT1
OUT2
OUT3
OUT4
OUT6
VBAT
IN VBAT OUT
Smart Power
CSNS GND
Figure 1. Dual 8.0 mΩ and dual 21 mΩ simplified application diagram
© NXP B.V. 2021.




 MC08XS6421DEK
1 Orderable parts
This section describes the part numbers available to be purchased along with their differences. Valid orderable part numbers are provided
on the web. To determine the orderable part numbers for this device, go to http://www.nxp.com and perform a part number search for the
following device numbers.
Table 1. Orderable part variations
Part number
Notes Temperature (TA)
Package
MC08XS6421BEK
MC08XS6421CEK
MC08XS6421DEK
(1)
-40 °C to 125 °C
SOICW 32-pin
exposed pad
Notes
1. To order parts in tape and reel, add the R2 suffix to the part number.
OUT1
RDS(on)
21 mΩ
OUT2
RDS(on)
21 mΩ
OUT3
RDS(on)
8.0 mΩ
OUT4
RDS(on)
8.0 mΩ
OUT6
Yes
12XS6D4
2
NXP Semiconductors




 MC08XS6421DEK
Table of contents
1 Orderable parts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
2 Internal block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
3 Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.1 Pinout diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3.2 Pin definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4 General product characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.1 Relationship between ratings and operating requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4.2 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4.3 Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.4 Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.5 Supply currents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
5 General IC functional description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5.3 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.4 Functional description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
5.5 Modes of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5.6 SPI interface and configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Functional block requirements and behaviors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.1 Self-protected high-side switches description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
6.2 Power supply functional block description and application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
6.3 Communication interface and device control functional block description and application information . . . . . . . . . . . . 54
7 Typical applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.1 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
7.2 EMC and EMI considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
7.3 PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.3 PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
7.4 Thermal information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
8 Packaging . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
8.1 Marking information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
8.2 Package mechanical dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63
9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
NXP Semiconductors
12XS6D4
3




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