PLANAR TRANSISTOR. HSC2625 Datasheet

HSC2625 TRANSISTOR. Datasheet pdf. Equivalent

Part HSC2625
Description NPN EPITAXIAL PLANAR TRANSISTOR
Feature HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HR200201 Issued Date : 1996.03.14 Revised Date : 20.
Manufacture Hi-Sincerity Mocroelectronics
Datasheet
Download HSC2625 Datasheet

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HR200201 Is HSC2625 Datasheet
Recommendation Recommendation Datasheet HSC2625 Datasheet





HSC2625
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HR200201
Issued Date : 1996.03.14
Revised Date : 2002.08.13
Page No. : 1/2
HSC2625
NPN EPITAXIAL PLANAR TRANSISTOR
Description
The HSC2625 is designed for triple diffused planer type high voltage,
high speed switching applications.
Absolute Maximum Ratings (Ta=25°C)
TO-3P
Maximum Temperatures
Storage Temperature ........................................................................................... -55 ~ +150 °C
Junction Temperature.................................................................................... +150 °C Maximum
Maximum Power Dissipation
Total Power Dissipation (Tc=25°C) .................................................................................... 80 W
Maximum Voltages and Currents
VCBO Collector to Base Voltage ....................................................................................... 450 V
VCEO Collector to Emitter Voltage.................................................................................... 400 V
VEBO Emitter to Base Voltage.............................................................................................. 7 V
IC Collector Current ............................................................................................................ 10 A
IB Base Current ..................................................................................................................... 3 A
Characteristics (Ta=25°C)
Symbol
BVCBO
BVCEO
BVEBO
ICBO
IEBO
*VCE(sat)
*VBE(sat)
*hFE1
*hFE2
Min.
450
400
7
-
-
-
-
10
6
Typ.
-
-
-
-
-
-
-
-
-
Max.
-
-
-
1
100
1.2
1.5
30
-
Unit Test Conditions
V IC=1mA
V IC=10mA
IE=100uA
mA VCB=450V
uA VEB=7V
V IC=4A, IB=800mA
V IC=4A, IB=800mA
IC=0.5A, VCE=5V
IC=4A, VCE=5V
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HSC2625
HSMC Product Specification



HSC2625
HI-SINCERITY
MICROELECTRONICS CORP.
TO-3P Dimension
Spec. No. : HR200201
Issued Date : 1996.03.14
Revised Date : 2002.08.13
Page No. : 2/2
A
B
r1
C
D
r2
E
R
S
a2
GH I H
F
a1 a3
123
J
Marking:
H SC
2625
Date Code
Control Code
Style: Pin 1.Base 2.Collector 3.Emitter
K LM
T
N
OP
a1
a1 r3
U
a1 a1 3-Lead TO-3P Plastic Package,
HSMC Package Code: R
DIM
Inches
Min. Max.
Millimeters
Min. Max.
A
0.6063 0.6220 15.40
15.80
B
0.5276 0.5433 13.40
13.80
C 0.3701 0.3858 9.40
9.80
D
- *0.3150 -
*8.00
E 0.1417 0.1575 3.60
4.00
F
0.5394 0.5551 13.70
14.10
G 0.4945 0.5102 12.56 12.96
H 0.7756 0.7913 19.70 20.10
I
0.9134 0.9291 23.20
23.60
J
0.1299 0.1457
3.30
3.70
K 0.0709 0.0866 1.80
2.20
L
0.1102 0.1260
2.80
3.20
M 0.6378 0.6614 16.20 16.80
DIM
Inches
Min. Max.
N 0.0315 0.0472
O 0.2028 0.2264
P 0.2028 0.2264
Q 0.7283 0.7441
R 0.1811 0.1969
S 0.0571 0.0650
T 0.0472 0.0630
a1 -
*3o
a2 -
*2o
a3 -
*1o
r1
φ3.10
φ3.30
r2 - *φ1.60
r3 - *R0.50
*: Typical
Millimeters
Min. Max.
0.80 1.20
5.15 5.75
5.15 5.75
18.50
18.90
4.60 5.00
1.45 1.65
1.20 1.60
- *3o
- *2o
- *1o
φ3.10
φ3.30
- *φ1.60
- *R0.50
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters.
3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.
4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
Lead: 42 Alloy; solder plating
Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSC2625
HSMC Product Specification





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