SWITCHING DIODE. HMBD4148 Datasheet

HMBD4148 DIODE. Datasheet pdf. Equivalent

HMBD4148 Datasheet
Recommendation HMBD4148 Datasheet
Part HMBD4148
Description HIGH-SPEED SWITCHING DIODE
Feature HMBD4148; HI-SINCERITY MICROELECTRONICS CORP. HMBD4148 HIGH-SPEED SWITCHING DIODE Spec. No. : HE6802 Issued D.
Manufacture Hi-Sincerity Mocroelectronics
Datasheet
Download HMBD4148 Datasheet




Hi-Sincerity Mocroelectronics HMBD4148
HI-SINCERITY
MICROELECTRONICS CORP.
HMBD4148
HIGH-SPEED SWITCHING DIODE
Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2004.09.01
Page No. : 1/3
Description
SOT-23
The HMBD4148 is designed for high-speed switching application in hybrid thick-and
thin-film circuits. The devices is manufactured by the silicon epitaxial planar process Diagram:
and packed in plastic surface mount package.
Features
Small SMD Package (SOT-23)
Ultra-high Speed
Low Forward Voltage
Fast Reverse Recovery Time
Absolute Maximum Ratings
Maximum Temperatures
Storage Temperature ........................................................................................................................... -65 ~ +150 °C
Junction Temperature .................................................................................................................................... +150 °C
Maximum Power Dissipation
Total Power Dissipation (TA=25°C) ............................................................................................................... 225 mW
Maximum Voltages and Currents (TA=25°C)
Continuous Reverse Voltage .............................................................................................................................. 70 V
Continuous Forward Current ......................................................................................................................... 200 mA
Peak Forward Surge Current......................................................................................................................... 500 mA
Electrical Characteristics (TA=25°C)
Characteristic
Forward Voltage
Reverse Breakdown
Reverse Current
Total Capacitance
Reverse Recovery Time
Symbol
Condition
Min Max Unit
VF IF=10mA
-
VR IR=100uA
100
IR VR=75V
-
CT VR=0, F=1MHz
-
Trr
IF=IR=10mA, RL=100, Measured
at IR=1mA
-
1
-
5
4
4
V
V
uA
pF
nS
HMBD4148
HSMC Product Specification



Hi-Sincerity Mocroelectronics HMBD4148
HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2004.09.01
Page No. : 2/3
A
L
3
BS
12
VG
C
D HK
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
J
Marking:
5H
Pb Free Mark
Pb-Free: " " (Note)
Normal: None
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
Pin Style: 1.Anode 2.NC 3.Cathode
Material:
Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A 2.80 3.04
B 1.20 1.60
C 0.89 1.30
D 0.30 0.50
G 1.70 2.30
H 0.013 0.10
J 0.085 0.177
K 0.32 0.67
L 0.85 1.15
S 2.10 2.75
V 0.25 0.65
*: Typical, Unit: mm
Important Notice:
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
HSMC reserves the right to make changes to its products without notice.
HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBD4148
HSMC Product Specification



Hi-Sincerity Mocroelectronics HMBD4148
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
TP
TL
Tsmax
Ramp-up
tP
tL
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Time within 5oC of actual Peak
Temperature (tP)
Ramp-down Rate
Time 25oC to Peak Temperature
Sn-Pb Eutectic Assembly
<3oC/sec
100oC
150oC
60~120 sec
<3oC/sec
183oC
60~150 sec
240oC +0/-5oC
10~30 sec
<6oC/sec
<6 minutes
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
Peak temperature
245oC ±5oC
260oC +0/-5oC
Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2004.09.01
Page No. : 3/3
Critical Zone
TL to TP
Pb-Free Assembly
<3oC/sec
150oC
200oC
60~180 sec
<3oC/sec
217oC
60~150 sec
260oC +0/-5oC
20~40 sec
<6oC/sec
<8 minutes
Dipping time
5sec ±1sec
5sec ±1sec
HMBD4148
HSMC Product Specification







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