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SWITCHING DIODE. HMBD4148 Datasheet |
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HI-SINCERITY
MICROELECTRONICS CORP.
HMBD4148
HIGH-SPEED SWITCHING DIODE
Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2004.09.01
Page No. : 1/3
Description
SOT-23
The HMBD4148 is designed for high-speed switching application in hybrid thick-and
thin-film circuits. The devices is manufactured by the silicon epitaxial planar process Diagram:
and packed in plastic surface mount package.
Features
• Small SMD Package (SOT-23)
• Ultra-high Speed
• Low Forward Voltage
• Fast Reverse Recovery Time
Absolute Maximum Ratings
• Maximum Temperatures
Storage Temperature ........................................................................................................................... -65 ~ +150 °C
Junction Temperature .................................................................................................................................... +150 °C
• Maximum Power Dissipation
Total Power Dissipation (TA=25°C) ............................................................................................................... 225 mW
• Maximum Voltages and Currents (TA=25°C)
Continuous Reverse Voltage .............................................................................................................................. 70 V
Continuous Forward Current ......................................................................................................................... 200 mA
Peak Forward Surge Current......................................................................................................................... 500 mA
Electrical Characteristics (TA=25°C)
Characteristic
Forward Voltage
Reverse Breakdown
Reverse Current
Total Capacitance
Reverse Recovery Time
Symbol
Condition
Min Max Unit
VF IF=10mA
-
VR IR=100uA
100
IR VR=75V
-
CT VR=0, F=1MHz
-
Trr
IF=IR=10mA, RL=100Ω, Measured
at IR=1mA
-
1
-
5
4
4
V
V
uA
pF
nS
HMBD4148
HSMC Product Specification
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HI-SINCERITY
MICROELECTRONICS CORP.
SOT-23 Dimension
Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2004.09.01
Page No. : 2/3
A
L
3
BS
12
VG
C
D HK
3-Lead SOT-23 Plastic
Surface Mounted Package
HSMC Package Code: N
J
Marking:
5H
Pb Free Mark
Pb-Free: " " (Note)
Normal: None
Note: Pb-free product can distinguish by the green
label or the extra description on the right
side of the label.
Pin Style: 1.Anode 2.NC 3.Cathode
Material:
• Lead solder plating: Sn60/Pb40 (Normal),
Sn/3.0Ag/0.5Cu or Pure-Tin (Pb-free)
• Mold Compound: Epoxy resin family,
flammability solid burning class: UL94V-0
DIM Min. Max.
A 2.80 3.04
B 1.20 1.60
C 0.89 1.30
D 0.30 0.50
G 1.70 2.30
H 0.013 0.10
J 0.085 0.177
K 0.32 0.67
L 0.85 1.15
S 2.10 2.75
V 0.25 0.65
*: Typical, Unit: mm
Important Notice:
• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.
• HSMC reserves the right to make changes to its products without notice.
• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.
Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454
• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C
Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMBD4148
HSMC Product Specification
|
HI-SINCERITY
MICROELECTRONICS CORP.
Soldering Methods for HSMC’s Products
1. Storage environment: Temperature=10oC~35oC Humidity=65%±15%
2. Reflow soldering of surface-mount devices
Figure 1: Temperature profile
TP
TL
Tsmax
Ramp-up
tP
tL
Tsmin
tS
Preheat
Ramp-down
25
t 25oC to Peak
Time
Profile Feature
Average ramp-up rate (TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Tsmax to TL
- Ramp-up Rate
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak Temperature (TP)
Time within 5oC of actual Peak
Temperature (tP)
Ramp-down Rate
Time 25oC to Peak Temperature
Sn-Pb Eutectic Assembly
<3oC/sec
100oC
150oC
60~120 sec
<3oC/sec
183oC
60~150 sec
240oC +0/-5oC
10~30 sec
<6oC/sec
<6 minutes
3. Flow (wave) soldering (solder dipping)
Products
Pb devices.
Pb-Free devices.
Peak temperature
245oC ±5oC
260oC +0/-5oC
Spec. No. : HE6802
Issued Date : 1995.12.09
Revised Date : 2004.09.01
Page No. : 3/3
Critical Zone
TL to TP
Pb-Free Assembly
<3oC/sec
150oC
200oC
60~180 sec
<3oC/sec
217oC
60~150 sec
260oC +0/-5oC
20~40 sec
<6oC/sec
<8 minutes
Dipping time
5sec ±1sec
5sec ±1sec
HMBD4148
HSMC Product Specification
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