Serial Interface. TSS461C Datasheet

TSS461C Datasheet PDF, Equivalent


Part Number

TSS461C

Description

Van Controller Serial Interface

Manufacture

TEMIC Semiconductors

Total Page 24 Pages
PDF Download
Download TSS461C Datasheet


TSS461C Datasheet
Qualpack TSS463 / TSS461C
TSS463 VAN
Van Controller Serial Interface
TSS461C VAN
Van Controller
TSS463/TSS461C
VAN Controllers
1999 January
TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY
Rev. 2 – January 1999
1

TSS461C Datasheet
Qualpack TS80C31X2/C32X2
1. Contents
1. Contents........................................................................................................................................................ 2
2. General Information ..................................................................................................................................... 3
3. Technology Information .............................................................................................................................. 4
3.1 WAFER PROCESS TECHNOLOGY ..................................................................................................................... 4
3.2 PRODUCT DESIGN .......................................................................................................................................... 5
3.3 PACKAGE TECHNOLOGY ................................................................................................................................. 6
3.3.1 SOIC.300 16 leads............................................................................................................................... 6
3.3.2 Other available packages .................................................................................................................... 7
3.4 TEST ............................................................................................................................................................. 7
3.5 DEVICE CROSS SECTION ................................................................................................................................ 8
3.6 WAFER PROCESS CONTROL ........................................................................................................................... 9
4. Qualification ............................................................................................................................................... 10
4.1 CHANGE PROCEDURE................................................................................................................................... 11
4.2 QUALIFICATION FLOW ................................................................................................................................... 12
4.3 WAFER PROCESS QUALIFICATION ................................................................................................................. 13
4.4 PACKAGE QUALIFICATION ............................................................................................................................. 14
4.5 DEVICE QUALIFICATION ................................................................................................................................ 16
4.5.1 ESD and Latch-up results .................................................................................................................. 17
4.5.2 Failure Mechanisms and Corrective Actions ..................................................................................... 17
4.5.3 Qualification status............................................................................................................................. 17
4.6 OUTGOING QUALITY AND RELIABILITY............................................................................................................ 18
4.6.1 AOQ (Average Outgoing Quality) ...................................................................................................... 18
4.6.2 EFR (Early Failure Rate).................................................................................................................... 19
4.6.3 LFR (Latent Failure Rate) .................................................................................................................. 19
5. User Information ........................................................................................................................................ 20
5.1 SOLDERING RECOMMENDATIONS .................................................................................................................. 20
5.2 DRY PACK ORDERING RULES ..................................................................................................................... 20
5.3 ESD CAUTION.............................................................................................................................................. 20
6. Environmental Information ....................................................................................................................... 21
7. Other Data ................................................................................................................................................... 22
7.1 ISO9001 APPROVAL CERTIFICATE................................................................................................................ 22
7.2 DATABOOK REFERENCE................................................................................................................................ 23
7.3 ADDRESS REFERENCE.................................................................................................................................. 23
8. Revision History......................................................................................................................................... 24
2 Rev. 2 – January 1999


Features Datasheet pdf Qualpack TSS463 / TSS461C TSS463 VAN Va n Controller Serial Interface TSS461C V AN Van Controller TSS463/TSS461C VAN C ontrollers 1999 January TEMIC SEMICOND UCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 1 Qualpack TS80C31X2/C32 X2 1. Contents 1. Contents............. ....................................... ....................................... ....................................... ...................... 2 2. General Inf ormation .............................. ....................................... ....................................... ......................... 3 3. Technolo gy Information ........................ ....................................... ....................................... ........................ 4 3.1 W AFER P ROCESS TECHNOLOGY ..................... ....................................... ....................................... .................. 4 3.2 PRODUCT DESIGN ...................................... ..................................................................
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