WLAN SiP. BGW200 Datasheet

BGW200 SiP. Datasheet pdf. Equivalent

Part BGW200
Description Low Power WLAN SiP
Feature BGW200 Low-power WLAN SiP Optimized for low-power mobile applications, this complete, single-package.
Manufacture Philips
Download BGW200 Datasheet

BGW200 Low-power
Complete, single-package 802.11b
solution for mobile handheld devices
Optimized for low-power mobile applications, this complete,
single-package 802.11b solution combines a baseband/MAC,
RF transceiver, and power amplifier into an ultra-small
(150 mm2) package. It delivers the industry’s lowest power
consumption in standby mode and supports coexistence with
Bluetooth® solutions.
The BGW200 is a complete, low-power 802.11b Wireless LAN (WLAN)
System-in-a-Package (SiP) solution optimized for battery-powered hand-
held devices. It enables consumers to connect to the growing number of
WLAN networks in offices, homes, and public places. It also allows service
providers to increase their network reach and customer base, enabling
complementary data and voice services across cellular/PCS and WLAN
networks. Coexistence support for Bluetooth 1.1 and 1.2 enables seamless
integration with Philips Bluetooth solutions.
Key features
Advanced, single-package WLAN SiP optimized for mobile handheld
No RF-critical design required
Low total cost of ownership
Lowest power consumption in standby mode: < 2 mW (typ)
Ultra-small form factor
Low-profile 68-pin HVQFN-like SiP package (10 x 15 x 1.3 mm)
Only three external components for entire solution
“No Host Load” design delivers easy integration and longer battery life
Host processor sleeps while BGW200 processes beacons
BGW200 wakes the host processor only upon data packet arrival
Co-exists with Bluetooth 1.1 and 1.2
Complete software drivers, utility, and diagnostic tools
Smartphones, cellular phones,VoIP wireless phones
PDAs, handheld computing devices,WLAN adapter cards (Secure Digital)
Portable audio/video devices, MP3 players
Other handhelds and electronic devices for wireless digital, audio, multi-
media, and telephony
The SiP format, with its complete system functionality, delivers quicker
design cycles, lower risk, simplified manufacturing, and a reduced bill of
materials.The single-package format also simplifies assembly and testing,
and reduces yield losses.The SiP delivers a complete, fully tested imple-
mentation of 802.11b functionality, so development teams can focus their
energy on innovative product design instead of solving complex issues
related to RF layout.
Ultra-small footprint, ultra-low power consumption
The BGW200 uses a single, 68-pin HVQFN-like package that measures
only 10 x 15 x 1.3 mm.The entire 802.11b solution requires only three
external components and uses less than 180 mm2 of circuit board area.
The BGW200 incorporates several features that decreases power con-
sumption.There is an integrated ARM7 processor, 1.25 Mbytes of SRAM,
256 Kbytes of ROM, optimized host interfaces (SDIO/SPI), and integrated
power management hardware/software algorithms.The result is the lowest
standby power consumption in the industry (less than 2 mW).
Superior “No Host Load” Architecture
The BGW200 is designed to place no load on the host processor, so
mobile devices can integrate WLAN functionality without compromis-
ing application performance or battery life.The BGW200 only interfaces

Low-power 802.11b SiP with baseband/MAC and RF transceiver for mobile handhelds
with the host processor when a valid data packet is received. So the
host processor is allowed to sleep while the BGW200 independently
processes 802.11 beacons.
Advanced RF subsystem
The integrated RF transceiver supports transmit output power control
from +8 to +18 dBm at the antenna port – enabling optimal range,
throughput, and power consumption.The integrated RF transceiver uses
The MAC protocol runs on an embedded ARM7 processor, for zero
overhead on the host processor.An instruction prefetch unit enhances
the performance of the ARM7.To support new MAC protocol features,
the BGW200 is also designed to support firmware upgrades.
a direct conversion radio architecture that minimizes external compo-
nents and eliminates the IF filter. For additional component reduction,
the integrated PA is internally matched to the ZIF radio. In addition to
the radio transceiver and power amplifier, the BGW200 also integrates
an Rx/Tx diversity switch, bandpass filter, balun, power supply decou-
Bluetooth coexistence
pling, and other passive components.
The BGW200 is designed to support collaborative coexistence between
802.11 and Bluetooth 1.1 and 1.2.A dedicated software and hardware
interface implements Packet Traffic Arbitration (PTA) with voice priority
between the BGW200 and the Bluetooth system.An auto shutdown
feature ensures that Bluetooth voice takes priority over other signals
and there is special support for burst and fragmented frames. Bluetooth
Reference designs and eval kits
Reference design software drivers support PocketPC™ and Linux™
operating systems. Drivers for Palm™ and Symbian™ are in develop-
ment.The BGW200 is backed by a complete set of software utility and
diagnostic tools, and is available in evaluation kits.
1.2 enhances coexistence further, by adding independent Adaptive
Frequency Hopping (AFH) capability.The Philips BGB20x family of
Bluetooth SiPs is designed to interface and coexist seamlessly with the
Table 1
Frequency Bands
2.4 to 2.5 GHz
Supports latest QoS and security standards
Advanced hardware and software algorithms, along with Wi-Fi Multi-
media Extensions (WME), provide advanced Quality of Service (QoS)
functions.This lets the BGW200 support real-time applications like VoIP
and non-real-time applications like email and web surfing.The BGW200
Data Rates
SiP Power Consumption (typical)
1, 2, 5.5, 11 Mbps
Tx: 731 mW @ 15 dBm
Rx: 415 mW
Standby: < 2 mW
Sleep Mode: 0.2 mW
is also designed to support the upcoming 802.11e standard.
The BGW200 has advanced security features, including 40- and 128-bit
WEP, WPA, CCX (Cisco Security),TKIP, and AES.The SiP is also de-
signed to support the upcoming 802.11i extension.
Table 2
Low-power 802.11b SiP
10 x 15 x 1.3 mm
Part Number

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