4 Megabit High Speed CMOS SRAM
The DPS128X32CV3/DPS128X32BV3 ‘’VERSA-STACK’’ module is
a revolutionary new high speed memory subsystem using Dense-Pac
Microsystems’ ceramic Stackable Leadless Chip Carriers (SLCC)
mounted on a co-fired ceramic substrate. It offers 4 Megabits of
SRAM in a package envelope of 1.090 x 1.090 x 0.252 inches.
The DPS128X32CV3/DPS128X32BV3 contains four individual
128K x 8 SRAMs, packaged in their own hermetically sealed SLCCs
making the module suitable for commercial, industrial and military
By using SLCCs, the ‘’Versa-Stack’’ family of modules offers a higher
board density of memory than available with conventional
through-hole, surface mount, module, or hybrid techniques.
The DPS128X32BV3 has one active low Chip Enable (CE) and while
the DPS128X32CV3 an active low Chip Enable (CE) and an active
high Select Line (SEL).
By using SLCCs, the ‘’Versa-Stack’’ family of modules offer a
higher board density of memory than available with
conventional through-hole, surface mount or hybrid
• Organizations Available:
128K x 32, 256K x 16, or 512K x 8
• Access Times:
20*, 25, 30, 35, 45ns
FUNCTIONAL BLOCK DIAGRAM
• Fully Static Operation
- No clock or refresh required
• Low Power Dissipation:
8.0mW (typ.) Full Standby
0.8W (typ.) Operating (x8)
• Single +5V Power Supply,
• TTL Compatible
• Common Data Inputs and Outputs
• Low Data Retention Current:
140µA typ. (2.0V)
w • 66-Pin PGA ‘’VERSA-STACK’’
w * Commercial only.
w PIN NAMES
.D A0 - A16
I/O0 - I/O31 Data Input/Output
aCE0 - CE3
Low Chip Enables
tSEL High Chip Enable
aWE0 - WE1 Write Enables
SOE Output Enable
VDD Power (+5V)
NOTE: SEL applies to the DPS128X32CV3 only, No Connect for the DPS128X32BV3 version.
This document contains information on a product that is currently released
to production at Dense-Pac Microsystems, Inc. Dense-Pac reserves the
right to change products or specifications herein without prior notice.