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Digital-to-Analog Converter. DAC082S085 Datasheet |
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January 2007
DAC082S085
8-Bit Micro Power DUAL Digital-to-Analog Converter with
Rail-to-Rail Output
General Description
The DAC082S085 is a full-featured, general purpose DUAL
8-bit voltage-output digital-to-analog converter (DAC) that
can operate from a single +2.7V to 5.5V supply and consumes
0.6 mW at 3V and 1.6 mW at 5V. The DAC082S085 is pack-
aged in 10-lead LLP and MSOP packages. The 10-lead LLP
package makes the DAC082S085 the smallest DUAL DAC in
its class. The on-chip output amplifier allows rail-to-rail output
swing and the three wire serial interface operates at clock
rates up to 40 MHz over the entire supply voltage range.
Competitive devices are limited to 25 MHz clock rates at sup-
ply voltages in the 2.7V to 3.6V range. The serial interface is
compatible with standard SPI™, QSPI, MICROWIRE and
DSP interfaces.
The reference for the DAC082S085 serves both channels and
can vary in voltage between 1V and VA, providing the widest
possible output dynamic range. The DAC082S085 has a 16-
bit input shift register that controls the outputs to be updated,
the mode of operation, the powerdown condition, and the bi-
nary input data. Both outputs can be updated simultaneously
or individually depending on the setting of the two mode of
operation bits.
A power-on reset circuit ensures that the DAC output powers
up to zero volts and remains there until there is a valid write
to the device. A power-down feature reduces power con-
sumption to less than a microWatt with three different termi-
nation options.
The low power consumption and small packages of the
DAC082S085 make it an excellent choice for use in battery
operated equipment.
The DAC082S085 is one of a family of pin compatible DACs,
including the 10-bit DAC102S085 and the 12-bit
DAC124S085. The DAC082S085 operates over the extended
industrial temperature range of −40°C to +105°C.
Features
■ Guaranteed Monotonicity
■ Low Power Operation
■ Rail-to-Rail Voltage Output
■ Power-on Reset to 0V
■ Simultaneous Output Updating
■ Wide power supply range (+2.7V to +5.5V)
■ Industry's Smallest Package
■ Power Down Modes
Key Specifications
■ Resolution
■ INL
■ DNL
■ Settling Time
■ Zero Code Error
■ Full-Scale Error
■ Supply Power
■ — Normal
— Power Down
8 bits
±0.5 LSB (max)
+0.18 / −0.13 LSB (max)
4.5 µs (max)
+15 mV (max)
−0.75 %FS (max)
0.6 mW (3V) / 1.6 mW (5V) typ
0.3 µW (3V) / 0.8 µW (5V) typ
Applications
■ Battery-Powered Instruments
■ Digital Gain and Offset Adjustment
■ Programmable Voltage & Current Sources
■ Programmable Attenuators
Pin Configuration
20195601
SPI™ is a trademark of Motorola, Inc.
© 2007 National Semiconductor Corporation
201956
20195602
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Ordering Information
Order Numbers
DAC082S085CISD
DAC082S085CISDX
DAC082S085CIMM
DAC082S085CIMMX
DAC082S085EVAL
Temperature Range
−40°C ≤ TA ≤ +105°C
−40°C ≤ TA ≤ +105°C
−40°C ≤ TA ≤ +105°C
−40°C ≤ TA ≤ +105°C
Block Diagram
Package
LLP
LLP Tape-and-Reel
MSOP
MSOP Tape-and-Reel
Evaluation Board (MSOP)
Top Mark
X77C
X77C
X76C
X76C
20195603
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Pin Descriptions
LLP
MSOP
Pin No.
1
2
3
4
5
6
7
Symbol
VA
VOUTA
VOUTB
NC
NC
GND
VREFIN
8 DIN
9 SYNC
10 SCLK
11
PAD
(LLP only)
Type
Description
Supply
Analog Output
Analog Output
Ground
Analog Input
Digital Input
Digital Input
Digital Input
Ground
Power supply input. Must be decoupled to GND.
Channel A Analog Output Voltage.
Channel B Analog Output Voltage.
Not Connected
Not Connected
Ground reference for all on-chip circuitry.
Unbuffered reference voltage shared by all channels. Must be decoupled
to GND.
Serial Data Input. Data is clocked into the 16-bit shift register on the falling
edges of SCLK after the fall of SYNC.
Frame synchronization input for the data input. When this pin goes low,
it enables the input shift register and data is transferred on the falling
edges of SCLK. The DAC is updated on the 16th clock cycle unless
SYNC is brought high before the 16th clock, in which case the rising edge
of SYNC acts as an interrupt and the write sequence is ignored by the
DAC.
Serial Clock Input. Data is clocked into the input shift register on the
falling edges of this pin.
Exposed die attach pad can be connected to ground or left floating.
Soldering the pad to the PCB offers optimal thermal performance and
enhances package self-alignment during reflow.
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