165 FBGA. K7I641882M Datasheet


K7I641882M FBGA. Datasheet pdf. Equivalent


K7I641882M


(K7I643682M / K7I641882M) 72Mb M-die DDRII SRAM Specification 165 FBGA
K7I643682M K7I641882M

2Mx36 & 4Mx18 DDRII CIO b2 SRAM

72Mb M-die DDRII SRAM Specification
165 FBGA with Pb & Pb-Free
(RoHS compliant)

www.DataSheet4U.com

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY. ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office. 2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or similar applications where Product failure couldresult in loss of life or personal or physical harm, or any military or defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

-1-

Aug. 2005 Rev 1.0

K7I643682M K7I641882M
Document Title
2Mx36-bit, 4Mx18-bit DDRII CIO b2 SRAM

2Mx36 & 4Mx18 DDRII CIO b2 SRAM

Revision History
Rev. No. 0.0 0.1 History 1. Initial document. 1. Correct the JTAG ID register definition 2. Correct the AC timing parameter (delete the tKHKH Max value) 1. A...



K7I641882M
K7I643682M
K7I641882M
2Mx36 & 4Mx18 DDRII CIO b2 SRAM
72Mb M-die DDRII SRAM Specification
165 FBGA with Pb & Pb-Free
(RoHS compliant)
www.DataSheet4U.com
INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,
EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE,
TO ANY INTELLECTUAL PROPERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.
ALL INFORMATION IN THIS DOCUMENT IS PROVIDED
ON AS "AS IS" BASIS WITHOUT GUARANTEE OR WARRANTY OF ANY KIND.
1. For updates or additional information about Samsung products, contact your nearest Samsung office.
2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-
lar applications where Product failure couldresult in loss of life or personal or physical harm, or any military
or defense application, or any governmental procurement to which special terms or provisions may apply.
* Samsung Electronics reserves the right to change products or specification without notice.
- 1 - Aug. 2005
Rev 1.0

K7I641882M
K7I643682M
K7I641882M
2Mx36 & 4Mx18 DDRII CIO b2 SRAM
Document Title
2Mx36-bit, 4Mx18-bit DDRII CIO b2 SRAM
Revision History
Rev. No.
History
0.0 1. Initial document.
0.1 1. Correct the JTAG ID register definition
2. Correct the AC timing parameter (delete the tKHKH Max value)
0.2 1. Add the Power-on Sequence specification
0.3 1. Correct the pin name table
0.4 1. Update the power consumption (Icc & Isb)
1.0 1. Finalize the datasheet
Draft Date
Mar. 9, 2003
Mar. 20, 2003
Aug. 16, 2004
Oct. 18, 2004
May. 17, 2005
Aug. 2, 2005
Remark
Advance
Preliminary
Preliminary
Preliminary
Preliminary
Final
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
- 2 - Aug. 2005
Rev 1.0




@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)