Schottky Diodes. MADS-002545-1307M Datasheet

MADS-002545-1307M Diodes. Datasheet pdf. Equivalent

Part MADS-002545-1307M
Description SURMOUNTTM Medium Barrier Silicon Schottky Diodes
Feature www.DataSheet4U.com SURMOUNTTM Medium Barrier Silicon Schottky Diodes: Cross-Over Quad Series Ultra.
Manufacture Tyco Electronics
Total Page 3 Pages
Datasheet
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MADS-002545-1307M
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SURMOUNTTM Medium Barrier Silicon Schottky Diodes:
MADS-002545-1307M
Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip
V1
Features
Ultra Low Parasitic Capitance and Inductance
Surface Mountable in Microwave Circuits , No
Wirebonds Required
Rugged HMIC Construction with Polyimide
Scratch Protection
Reliable, Multilayer Metalization with a Diffusion
Barrier, 100% Stabilization Bake (300 °C, 16 hours)
Lower Susceptibility to ESD Damage
Description and Applications
The MADS-002545-1307M Series SurMount
Medium Barrier, Silicon Schottky Cross-Over Quad
Diodes are fabricated with the patented Heterolithic
Microwave Integrated Circuit (HMIC) process. HMIC
circuits consist of Silicon pedestals which form diodes or
via conductors embedded in a glass dielectric, which
acts as the low dispersion, low loss, microstrip transmission
medium. The combination of silicon and glass allows
HMIC devices to have excellent loss and power dissipation
characteristics in a low profile, reliable device.
The Surmount Schottky devices are excellent
choices for circuits requiring the small parasitics of a
beam lead device coupled with the superior mechanical
performance of a chip. The SurMount structure employs
very low resistance silicon vias to connect the Schottky
contacts to the metalized mounting pads on the
bottom surface of the chip. These devices are
reliable, repeatable, and a lower cost performance
solution to conventional devices. They have lower
susceptibility to electrostatic discharge than
conventional beam lead Schottky diodes.
The multi-layer metalization employed in the fabrication of
the Surmount Schottky junctions includes a platinum
diffusion barrier, which permits all devices to be subjected to
a 16-hour non-operating stabilization bake at 300°C.
The “ 0202 ” outline allows for Surface Mount placement
and multi- functional polarity orientations. The
MADS-002545-1307M Series SurMountä Medium Barrier
Silicon Schottky Cross-Over Quad Diodes are
recommended for use in microwave circuits through Ku
band frequencies for lower power applications such as
mixers, sub-harmonic mixers, detectors and limiters. The
HMIC construction facilitates the direct replacement of more
fragile beam lead diodes with the corresponding Surmount
diode, which can be connected to a hard or soft substrate
circuit with solder.
1
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Topview
A
B
DE
D
Sideview
Case Style 1307
C
MADS-002545-1307M
Equivalent Circuit
Dim
A
B
C
D Sq.
E Sq.
Inches
Min. Max.
0.023
0.025
0.023
0.025
0.004
0.008
0.007
0.009
0.007
0.009
Millimeters
Min. Max.
0.575 0.625
0.575 0.625
0.102 0.203
0.175 0.225
0.175 0.225
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.



MADS-002545-1307M
SURMOUNTTM Medium Barrier Silicon Schottky Diodes:
MADS-002545-1307M
Cross-Over Quad Series Ultra-small 600x600um Surface-Mount Chip
V1
Electrical Specifications @ + 25 °C (Measured as Single Diodes)
Model
Number
Type
Recommended
Frequency
Range
Vf @ 1 mA
( mV )
Vf @ 1mA
( mV )
Ct @ 0V
( pF )
Rt Slope Resistance
( Vf1–Vf2 ) /
( 10.5mA – 9.5mA )
()
MADS-002545-1307M Medium DC – 18 GHz
Barrier
470 Max
390 Typ
10 Max
0.22 Max
0.11 Typ
10 Typical
18 Max
Rt is the dynamic slope resistance where Rt = Rs + Rj where Rj =26 / Idc ( Idc is in mA ) and Rs is the Ohmic Resistance.
Handling Procedures
All semiconductor chips should be handled with care
to avoid damage or contamination from perspiration
and skin oils. The use of plastic tipped tweezers or
vacuum pickups is strongly recommended for individual
components. The top surface of the die has a protective
polyimide coating to minimize damage.
The rugged construction of these SurMount devices
allows the use of standard handling and die attach
techniques. It is important to note that industry standard
electrostatic discharge (ESD) control is required at
all times, due to the sensitive nature of Schottky
junctions. Bulk handling should insure that abrasion
and mechanical shock are minimized.
Die Bonding
Die attach for these devices is made simple through
the use of surface mount die attach technology.
Mounting pads are conveniently located on the bottom
surface of these devices, and are opposite the active
junction. The devices are well suited for high
temperature solder attachment onto hard substrates.
80Au/20Sn and Sn63/Pb36/Ag2 solders are
acceptable for usage. Maximum solder re-flow
temperature is 320 °C for 10 seconds.
2
M/A-COM Inc. and its affiliates reserve the right to make changes to the
product(s) or information contained herein without notice. M/A-COM makes
no warranty, representation or guarantee regarding the suitability of its
products for any particular purpose, nor does M/A-COM assume any liability
whatsoever arising out of the use or application of any product(s) or
information.
Absolute Maximum Ratings @ 25 °C 1
Parameter
Absolute Maximum
Operating Temperature
-40 °C to +125 °C
Storage Temperature
-40 °C to +150 °C
Junction Temperature
+175 °C
Die Bonding Temperature
+320 °C for 10 sec.
Forward Current
20 mA
Reverse Voltage l - 10 µ A l
I -5 V I
RF C.W. Incident Power
+20 dBm C.W.
RF & DC Dissipated Power
50 mW
1. Operation of this device above any one of these parameters
may cause permanent damage.
Die Bonding
For Hard substrates, we recommend utilizing a
vacuum tip and force of 60 to 100 grams applied
uniformly to the top surface of the device, using a
hot gas bonder with equal heat applied across the
bottom mounting pads of the device. When soldering
to soft substrates, it is recommended to use a
lead-tin interface at the circuit board mounting pads.
Position the die so that its mounting pads are
aligned with the circuit board mounting pads. Reflow
the solder paste by applying Equal heat to the circuit
at both die-mounting pads. The solder joint must Not
be made one at a time, creating un-equal heat flow
and thermal stress. Solder reflow should Not be
performed by causing heat to flow through the top
surface of the die. Since the HMIC glass is transparent, the
edges of the mounting pads can be visually inspected
through the die after die attach is completed.
North America Tel: 800.366.2266 / Fax: 978.366.2266
Europe Tel: 44.1908.574.200 / Fax: 44.1908.574.300
Asia/Pacific Tel: 81.44.844.8296 / Fax: 81.44.844.8298
Visit www.macom.com for additional data sheets and product information.





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