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SIGC06T60 Datasheet, Equivalent, IGBT.

IGBT

IGBT

 

 

 

Part SIGC06T60
Description IGBT
Feature www.
DataSheet4U.
com SIGC06T60 IGBT Chip FEATURES:
• 600V Trench & Field Stop technology
• low VCE(sat)
• low tu rn-off losses
• short tail current positive temperature coefficient
• easy paralleling 3 This chip is used f or:
• power module
• discrete compo nents Applications:
• drives
• whit e goods
• resonant applications C G E Chip Type SIGC06T60 VCE 600V ICn 10A Die Size 2.
42 x 2.
38 mm2 Package sawn on foil Ordering Code Q67050A433 1-A101 MECHANICAL PARAMETER: Raster si ze Emitter pad size Gate pad size Area total / active Thickness Wafer size Fla t position Max.
possible chips per w .
Manufacture Infineon Technologies
Datasheet
Download SIGC06T60 Datasheet
Part SIGC06T60
Description IGBT
Feature www.
DataSheet4U.
com SIGC06T60 IGBT Chip FEATURES:
• 600V Trench & Field Stop technology
• low VCE(sat)
• low tu rn-off losses
• short tail current positive temperature coefficient
• easy paralleling 3 This chip is used f or:
• power module
• discrete compo nents Applications:
• drives
• whit e goods
• resonant applications C G E Chip Type SIGC06T60 VCE 600V ICn 10A Die Size 2.
42 x 2.
38 mm2 Package sawn on foil Ordering Code Q67050A433 1-A101 MECHANICAL PARAMETER: Raster si ze Emitter pad size Gate pad size Area total / active Thickness Wafer size Fla t position Max.
possible chips per w .
Manufacture Infineon Technologies
Datasheet
Download SIGC06T60 Datasheet

SIGC06T60

SIGC06T60
SIGC06T60

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