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SIGC61T60NC Datasheet, Equivalent, IGBT.IGBT IGBT |
Part | SIGC61T60NC |
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Description | IGBT |
Feature | www. DataSheet4U. com Preliminary SIGC61 T60NC IGBT Chip in NPT-technology FEATU RES: • 600V NPT technology • 100µm chip • short circuit prove • posit ive temperature coefficient • easy pa ralleling C This chip is used for: • IGBT-Modules Applications: • drives G E Chip Type SIGC61T60NC VCE 600V ICn 75A Die Size 6. 99 x 8. 79 mm2 Pac kage sawn on foil Ordering Code Q67050 -A4160A001 MECHANICAL PARAMETER: Raste r size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max. possible chips per w afer Passivation frontside Emitter meta llization Collector metalliza . |
Manufacture | Infineon Technologies |
Datasheet |
Part | SIGC61T60NC |
---|---|
Description | IGBT |
Feature | www. DataSheet4U. com Preliminary SIGC61 T60NC IGBT Chip in NPT-technology FEATU RES: • 600V NPT technology • 100µm chip • short circuit prove • posit ive temperature coefficient • easy pa ralleling C This chip is used for: • IGBT-Modules Applications: • drives G E Chip Type SIGC61T60NC VCE 600V ICn 75A Die Size 6. 99 x 8. 79 mm2 Pac kage sawn on foil Ordering Code Q67050 -A4160A001 MECHANICAL PARAMETER: Raste r size Area total / active Emitter pad size Gate pad size Thickness Wafer size Flat position Max. possible chips per w afer Passivation frontside Emitter meta llization Collector metalliza . |
Manufacture | Infineon Technologies |
Datasheet |
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