Small Signal Transistors N - Channel Switch/Chopper J FET Chip
Description
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PROCESS
Small Signal Transistors
N - Channel Switch/Chopper J FET Chip
CP206
Central
TM
Semiconductor Corp.
PROCESS DETAILS Process Die Size Die Thickness Drain Bonding Pad Area Source Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 30,950 PRINCIPAL DEVICE TYPE...
