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Flash Memory. 25X64 Datasheet

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Flash Memory. 25X64 Datasheet






25X64 Memory. Datasheet pdf. Equivalent




25X64 Memory. Datasheet pdf. Equivalent





Part

25X64

Description

Serial Flash Memory



Feature


W25X16, W25X16A, W25X32, W25X64 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMO RY WITH 4KB SECTORS AND DUAL OUTPUT SPI Publication Release Date: May 5, 2008 -1- Revision I W25X16, W25X16A, W25 X32, W25X64 Table of Contents 1. GENE RAL DESCRIPTION ....................... ....................................... ....................................... .... 4 2. FEATURE.
Manufacture

Winbond

Datasheet
Download 25X64 Datasheet


Winbond 25X64

25X64; S ...................................... ....................................... ....................................... ............. 4 3. PIN CONFIGURATION SOIC 150-MIL........................... ....................................... ..................... 5 4. PIN CONFIG URATION SOIC 208-MIL................... ....................................... ...................


Winbond 25X64

........... 5 5. PAD CONFIGURATION WSO N 6X5-MM & 8X6-MM ..................... ....................................... .... 5 6. PIN CONFIGURATION PDIP 300- MIL ................................... ....................................... ............. 6 7. PIN DESCRIPTION SOI C 150 / 208-MIL, PDIP 300-MIL, WSON 6X5 / 8X6-MM ..................... 6 8. PIN CONFIGURATION .


Winbond 25X64

SOIC 300-MIL............................ ....................................... .................... 7 9. PIN DESCRIPT ION SOIC 300-MIL ...................... ....................................... ............................... 7 9.1 Package Types ......................... ....................................... ....................................... ........ 8 9.2 Ch.

Part

25X64

Description

Serial Flash Memory



Feature


W25X16, W25X16A, W25X32, W25X64 16M-BIT, 32M-BIT, AND 64M-BIT SERIAL FLASH MEMO RY WITH 4KB SECTORS AND DUAL OUTPUT SPI Publication Release Date: May 5, 2008 -1- Revision I W25X16, W25X16A, W25 X32, W25X64 Table of Contents 1. GENE RAL DESCRIPTION ....................... ....................................... ....................................... .... 4 2. FEATURE.
Manufacture

Winbond

Datasheet
Download 25X64 Datasheet




 25X64
W25X16, W25X16A, W25X32, W25X64
16M-BIT, 32M-BIT, AND 64M-BIT
SERIAL FLASH MEMORY WITH
4KB SECTORS AND DUAL OUTPUT SPI
Publication Release Date: May 5, 2008
-1-
Revision I




 25X64
W25X16, W25X16A, W25X32, W25X64
Table of Contents
1. GENERAL DESCRIPTION ......................................................................................................... 4
2. FEATURES ................................................................................................................................. 4
3.
PIN CONFIGURATION SOIC 150-MIL....................................................................................... 5
4.
PIN CONFIGURATION SOIC 208-MIL....................................................................................... 5
5.
PAD CONFIGURATION WSON 6X5-MM & 8X6-MM ................................................................ 5
6.
PIN CONFIGURATION PDIP 300-MIL ....................................................................................... 6
7. PIN DESCRIPTION SOIC 150 / 208-MIL, PDIP 300-MIL, WSON 6X5 / 8X6-MM ..................... 6
8.
PIN CONFIGURATION SOIC 300-MIL....................................................................................... 7
9. PIN DESCRIPTION SOIC 300-MIL ............................................................................................ 7
9.1 Package Types ............................................................................................................... 8
9.2 Chip Select (/CS) ............................................................................................................ 8
9.3 Serial Data Output (DO) ................................................................................................. 8
9.4 Write Protect (/WP)......................................................................................................... 8
9.5 HOLD (/HOLD) ............................................................................................................... 8
9.6 Serial Clock (CLK) .......................................................................................................... 8
9.7 Serial Data Input / Output (DIO) ..................................................................................... 8
10. BLOCK DIAGRAM ...................................................................................................................... 9
11. FUNCTIONAL DESCRIPTION ................................................................................................. 10
11.1
SPI OPERATIONS ....................................................................................................... 10
11.1.1 SPI Modes ....................................................................................................................10
11.1.2 Dual Output SPI............................................................................................................10
11.1.3 Hold Function ...............................................................................................................10
11.2 WRITE PROTECTION.................................................................................................. 11
11.2.1 Write Protect Features..................................................................................................11
12. CONTROL AND STATUS REGISTERS................................................................................... 12
12.1
STATUS REGISTER .................................................................................................... 12
12.1.1 BUSY............................................................................................................................12
12.1.2 Write Enable Latch (WEL) ............................................................................................12
12.1.3 Block Protect Bits (BP2, BP1, BP0)..............................................................................12
12.1.4 Top/Bottom Block Protect (TB).....................................................................................12
12.1.5 Reserved Bits ...............................................................................................................12
12.1.6 Status Register Protect (SRP) ......................................................................................13
12.1.7 Status Register Memory Protection ..............................................................................14
12.2 INSTRUCTIONS........................................................................................................... 16
12.2.1 Manufacturer and Device Identification.........................................................................16
-2-




 25X64
W25X16, W25X16A, W25X32, W25X64
12.2.2 Instruction Set...............................................................................................................17
12.2.3 Write Enable (06h)........................................................................................................18
12.2.4 Write Disable (04h).......................................................................................................18
12.2.5 Read Status Register (05h) ..........................................................................................19
12.2.6 Write Status Register (01h) ..........................................................................................20
12.2.7 Read Data (03h) ...........................................................................................................21
12.2.8 Fast Read (0Bh) ...........................................................................................................22
12.2.9 Fast Read Dual Output (3Bh) .......................................................................................23
12.2.10 Page Program (02h) ...................................................................................................24
12.2.11 Sector Erase (20h) .....................................................................................................25
12.2.12 Block Erase (D8h) ......................................................................................................26
12.2.13 Chip Erase (C7h)........................................................................................................27
12.2.14 Power-down (B9h) ......................................................................................................28
12.2.15 Release Power-down / Device ID (ABh) .....................................................................29
12.2.16 Read Manufacturer / Device ID (90h) .........................................................................31
12.2.17 JEDEC ID (9Fh)..........................................................................................................32
13. ELECTRICAL CHARACTERISTICS......................................................................................... 33
13.1 Absolute Maximum Ratings .......................................................................................... 33
13.2 Operating Ranges......................................................................................................... 33
13.3 Endurance and Data Retention .................................................................................... 34
13.4 Power-up Timing and Write Inhibit Threshold .............................................................. 34
13.5 DC Electrical Characteristics ........................................................................................ 35
13.6 AC Measurement Conditions........................................................................................ 36
13.7 AC Electrical Characteristics ........................................................................................ 37
13.8 Serial Output Timing ..................................................................................................... 39
13.9 Input Timing .................................................................................................................. 39
13.10 Hold Timing ................................................................................................................. 39
14. PACKAGE SPECIFICATION .................................................................................................... 40
14.1 8-Pin SOIC 150-mil (Package Code SN)...................................................................... 40
14.2 8-Pin SOIC 208-mil (Package Code SS)...................................................................... 41
14.3 8-Pin PDIP 300-mil (Package Code DA) ...................................................................... 42
14.4 8-Contact 6x5mm WSON (Package Code ZP) ............................................................ 43
14.5 8-Contact 8x6mm WSON (Package Code ZE) ............................................................ 45
14.6 16-Pin SOIC 300-mil (Winbond Package Code SF)..................................................... 46
15. ORDERING INFORMATION .................................................................................................... 47
16. REVISION HISTORY ................................................................................................................ 49
Publication Release Date: may 5, 2008
-3-
Revision I



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