Dropout Regulator. LX8820 Datasheet

LX8820 Regulator. Datasheet pdf. Equivalent

Part LX8820
Description 3.3V/1.0A Ultra Low Dropout Regulator
Feature LX8820 TM ® 3.3V/1.0A Ultra Low Dropout Regulator P RODUCTION DATA SHEET DESCRIPTION The LX8820 is.
Manufacture Microsemi Corporation
Datasheet
Download LX8820 Datasheet



LX8820
LX8820
TM ® 3.3V/1.0A Ultra Low Dropout Regulator
PRODUCTION DATA SHEET
DESCRIPTION
The LX8820 is an ultra low- The low RDSON of the PMOS output
dropout single output positive- stage results in ultra low dropout
voltage linear regulator. The (typically 0.45V @ 1A).
regulator has a precise, fixed Output voltage overshoot is
output capable of delivering 1.2 controlled using slew rate control, as
amps.
VIN is applied, typically VOUT overshoot
The LX8820 output is internally < 2% for VIN 1V/µS ramp. Transient
programmed for 3.3V.
response to a Step Load is fast and
Regulator stability is maintained controlled, VOUT overshoot remains
www.DataShweietht4Ua.cnoym capacitor ESR, allowing within 2% of nominal for 400mA step
ceramic, tantalum or electrolytic sizes.
types. Capacitance range is Thermal Shutdown, Current Limit
flexible beginning with 2.2µF to and Short Circuit Current protection
large values.
are integrated on-chip for survival
The CMOS wafer process during fault conditions.
increasing regulator efficiency by Microsemi’s small 3x3mm body size
minimizing operating ground (MO-229) package enables maximum
current (typically <200µA). power dissipation with a minimum
compared to BiPolar technology . surface mount area.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATURES
ƒ Accurate Output Voltage
ƒ Typical Dropout of 0.7V at 1A
and 0.25V at 0.8A
ƒ Independent Thermal and
Current Limit Protection
ƒ Low Tolerance Load Regulation
(0.4%)
ƒ Wide DC Supply Voltage of 4V
to 10V
ƒ Loop Stability Independent of
Output Capacitor Type
ƒ JEDEC MO-229 surface mount
package / RoHS Compliant
APPLICATIONS/BENEFITS
ƒ 5V to 3.3V Regulators
ƒ Hard Disk Drives, CD-ROMs
ƒ ADSL and Cable Modems
ƒ Battery Charging Circuits
ƒ Instrumentation
ƒ PC Peripherals
APPLICATION CIRCUITS
VIN 3.8 to 6V
4.7µF
1
VIN
2
GND
3
N.C.
VIN
VOUT
VOUT
LX8820
6
5
4
VOUT 3.3V @ 1A
4.7µF
TJ (°C)
0 to 125
PACKAGE ORDER INFO
OUTPUT V
3.3V
Plastic MLP 6-
LM PIN
RoHS Compliant / Pb-free
LX8820-33CLM
Part Marking
882J or 8820
Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX8820-33CLM-TR)
Copyright © 2004
Rev. 1.1, 2005-02-24
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1



LX8820
LX8820
TM ® 3.3V/1.0A Ultra Low Dropout Regulator
PRODUCTION DATA SHEET
ABSOLUTE MAXIMUM RATINGS
Input Voltage (VIN) ....................................................................................................... 10V
Load Current (Internally Limited)................................................................................... 2A
Power Dissipation ................................................................................... Internally Limited
Short-Circuit Protection ........................................................................................Indefinite
Operating Junction Temperature................................................................................ 150°C
Storage Temperature Range........................................................................ -65°C to 150°C
RoHS / Pb-free Peak Package Solder Reflow Temperature
(40 second maximum exposure) ....................................................................260°C (+0,-5)
www.DataSheNeto4tUe:.coEmxceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
THERMAL DATA
LM Plastic MLP 6-Pin
THERMAL RESISTANCE-JUNCTION TO TAB, θJT
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
(Typical, depending on mounting/pcb layout)
8°C/W
29-35°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJA).
The θJA numbers are guidelines for the thermal performance of the device/pc-board
system. All of the above assume no ambient airflow. θJA can vary significantly depending
on mounting technique. (See Application Notes Section: Thermal considerations)
PACKAGE PIN OUT
VIN
GND
1
2
N.C. 3
6 VIN
5 VOUT
4 VOUT
LM PACKAGE
(Top View)
Heatsink must be connected to GND
or left floating (see pg 7 for details)
. N/C = Not internally connected, don’t
care for PCB layout consideration.
RoHS / Pb-free 100% Matte Tin Lead Finish
PIN NAME
VIN
GND
VOUT
FUNCTIONAL PIN DESCRIPTION
DESCRIPTION
Positive unregulated supply input for the regulator. Bypass to GND with at least 2.2µF of low ESR and ESL
capacitance.
Common terminal for ground reference. The input and output bypass capacitors should be connected to this
pin.
Regulator output. It is recommended to bypass to GND with at least 2.2µF. Size your output capacitor to meet
the transient loading requirement. If you have a very dynamic load, a lower ESR capacitor will improve the
response to these load steps.
RECOMMENDED MAX OPERATING CONDITIONS
Parameter
Input Voltage
Load Current (with adequate heat sinking)
Operating Junction Temperature
Symbol
VIN
IL
TJ
LX8820-33
Min Typ
4.5
Max
10
1200
125
Units
V
mA
°C
Copyright © 2004
Rev. 1.1, 2005-02-24
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2





@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)