Central
www.DataSheet4U.com
TM
PROCESS
CPQ130
Triac
Semiconductor Corp.
12 Amp, 600 Volt Triac Chip
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GLASS PASSIVATED MESA 130 MILS x 130 MILS 8.6 MILS ± 0.6 MILS 99 MILS x 49 MILS 34 MILS x 34 MILS Al - 45,000Å Al/Mo/Ni...
