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HDMI05-CL02F3 Datasheet, Equivalent, Signal Conditioning.EMI Filtering & Signal Conditioning EMI Filtering & Signal Conditioning |
　
　
　
| Part | HDMI05-CL02F3 |
|---|---|
| Description | EMI Filtering & Signal Conditioning |
| Feature | HDMI05-CL02F3
www. datasheet4u. com 5-lin e IPADâ„¢, HDMIâ„¢ control line ESD pro tection Features â– â– â– â– â– â – Low line capacitance: 12 pF max. Hi gh efficiency in ESD protection Lead-fr ee package Very thin package High relia bility offered by monolithic integratio n High reduction of parasitic elements through integration and wafer level pac kaging Figure 1. Pin configuration (bum p side) Flip Chip 9 bumps Complies wit h the standards: â– IEC 61000-4-2 Lev el 4 – ± 15 kV (air discharge) –  ± 8 kV (contact discharge) IEC 61000-4- 2 Level 1 – ± 2 kV (air discharge) â €“ ± 2 kV (contact discharge) 3 SCL 2 CEC . |
| Manufacture | ST Microelectronics |
| Datasheet |
| Part | HDMI05-CL02F3 |
|---|---|
| Description | EMI Filtering & Signal Conditioning |
| Feature | HDMI05-CL02F3
www. datasheet4u. com 5-lin e IPADâ„¢, HDMIâ„¢ control line ESD pro tection Features â– â– â– â– â– â – Low line capacitance: 12 pF max. Hi gh efficiency in ESD protection Lead-fr ee package Very thin package High relia bility offered by monolithic integratio n High reduction of parasitic elements through integration and wafer level pac kaging Figure 1. Pin configuration (bum p side) Flip Chip 9 bumps Complies wit h the standards: â– IEC 61000-4-2 Lev el 4 – ± 15 kV (air discharge) –  ± 8 kV (contact discharge) IEC 61000-4- 2 Level 1 – ± 2 kV (air discharge) â €“ ± 2 kV (contact discharge) 3 SCL 2 CEC . |
| Manufacture | ST Microelectronics |
| Datasheet |
　
　
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