Power Transistor NPN - Silicon Power Transistor Chip
Description
PROCESS
CP283
Power TransistorNPN - Silicon Power Transistor Chip
Central
TM
Semiconductor Corp.
PROCESS DETAILS Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization 68 x 68 MILS 9.5 MILS 18 x 11 MILS 18 x 12 MILS Al - 45,000Å Ti/Ni/Ag - (3000Å, 10,000Å, 10,000Å)
GEOMETRY GROSS DIE PER 5 I...
