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SDIP30

Part Number	SDIP30
Manufacturer	STMicroelectronics
Description	SDIP30 Thermal Data
Published	Mar 20, 2010
Detailed Description	 Thermal Data SDIP 30 www.DataSheet4U.com 30 leads PACKAGE MATERIAL LIST item # material thickness thermal conducti...
Datasheet	SDIP30 PDF File

Overview

 Thermal Data SDIP 30 www.
DataSheet4U.
com 30 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.
61 W/cm°C 0.
01 W/cm°C leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.
25 mm 10-40 µm molding compound 3.
8 mm 0.
0063W/cm°C Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time September 1999 1/2 Thermal Data SDIP 30 www.
DataSheet4U.
com Rth(j-a) (ºC/W) 75 1) 70 die size 160x80 sq.
mils mounted on a low K board (1s 1 Oz.
) 80x80 sq.
mils dissipating area 65 60 80x160 sq.
mils dissipating area 55 0 0.
5 1 1.
5 dissipated power ( Watt ) 2 2.
5 Zth( ºC/W) 2) 10 die size 160x80 sq.
mils 80x80 sq.
mils dissipating area...

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