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Pligging Ink. PSR-4000PF9L Datasheet

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Pligging Ink. PSR-4000PF9L Datasheet






PSR-4000PF9L Ink. Datasheet pdf. Equivalent




PSR-4000PF9L Ink. Datasheet pdf. Equivalent





Part

PSR-4000PF9L

Description

Liquid Photoimageable Hole Pligging Ink



Feature


www.DataSheet4U.com 1/4 DATA SHEET 2007 .01 Z TAIWAN TAIYO INK CO.,LTD No.7, Ta Tung 2nd Rd., Kuan-Yin Industry Park T aoyuan, Taiwan, R.O.C. TEL:886-3-483-32 31 FAX:886-3-483-3599 PSR-4000 PF9L / CA-40 PF9 (PSR-4000GW / CA-40GW) 1. FEA TURES : PSR-4000 PF9L / CA-40 PF9 is a liquid photo imageable hole plugging in k ( alkaline development type ), used f or screen printing.
Manufacture

Taiyo

Datasheet
Download PSR-4000PF9L Datasheet


Taiyo PSR-4000PF9L

PSR-4000PF9L; . Which has the characteristic such as n ot appear the crack hollow are less fin e blistering resistance tack dry window are wider fine solvent resistance 2. SPECIFICATION : Main agent Hardener Col or* Mixing ratio Viscosity* Tack free w indow* Exposure energy* Pot life* Shelf life** * ** PSR-4000 PF9L CA-40 PF9 Gr een Main agent : 70 / Hardener : 30 150 dPa‧s 80 / 70 min.


Taiyo PSR-4000PF9L

( By weight ) ) (Cone / Plate Viscomete r, 5min-1 / 25 ( Maximum ) ( on the so lder mask ) ( stored in dark place at l ess than 25 ( stored in dark place at l ess than 25 ) ) 300 ~ 500 mJ/cm2 24 ho urs 6 months : After mixing : After ma nufacturing www.DataSheet4U.com 2/4 D ATA SHEET 3. PROCESS CONDITION PROCESS PWB Pre-treatment Printing Hold time FR – 4 , 1.6 mm Acid.


Taiyo PSR-4000PF9L

treatment 100 mesh-count 10 min brushin g PSR-4000 PF9L /CA-40 PF9 RANGE 90 ~ 125 mesh 10 ~ 20 min 80 80 80 / 10~20 min / 20~30 min / 20~40 min Tack free Both sides simultaneous exposure 1 st printing : 80 / 15 min 2nd printing : 80 / 25 min ( Hot air convention oven ) Single side exposure 80 / 30 min ( Hot air convection oven ) 400 mJ/cm2 ( on the solder mask ) .

Part

PSR-4000PF9L

Description

Liquid Photoimageable Hole Pligging Ink



Feature


www.DataSheet4U.com 1/4 DATA SHEET 2007 .01 Z TAIWAN TAIYO INK CO.,LTD No.7, Ta Tung 2nd Rd., Kuan-Yin Industry Park T aoyuan, Taiwan, R.O.C. TEL:886-3-483-32 31 FAX:886-3-483-3599 PSR-4000 PF9L / CA-40 PF9 (PSR-4000GW / CA-40GW) 1. FEA TURES : PSR-4000 PF9L / CA-40 PF9 is a liquid photo imageable hole plugging in k ( alkaline development type ), used f or screen printing.
Manufacture

Taiyo

Datasheet
Download PSR-4000PF9L Datasheet




 PSR-4000PF9L
www.DataSheet41U/.4com
DATA SHEET
Z TAIWAN TAIYO INK CO.,LTD
2007.01
No.7, Ta Tung 2nd Rd., Kuan-Yin Industry Park Taoyuan, Taiwan, R.O.C.
TEL:886-3-483-3231
FAX:886-3-483-3599
PSR-4000 PF9L / CA-40 PF9
(PSR-4000GW / CA-40GW)
1. FEATURES :
PSR-4000 PF9L / CA-40 PF9 is a liquid photo imageable hole plugging ink ( alkaline
development type ), used for screen printing. Which has the characteristic such as
not appear the crack
hollow are less
fine blistering resistance
tack dry window are wider
fine solvent resistance
2. SPECIFICATION :
Main agent
Hardener
Color*
Mixing ratio
Viscosity*
Tack free window*
Exposure energy*
Pot life*
Shelf life**
PSR-4000 PF9L
CA-40 PF9
Green
Main agent : 70 / Hardener : 30
( By weight )
150 dPas
(Cone / Plate Viscometer, 5min-1 / 25 )
80 / 70 min
300 ~ 500 mJ/cm2
( Maximum )
( on the solder mask )
24 hours
( stored in dark place at less than 25 )
6 months
( stored in dark place at less than 25 )
* : After mixing
** : After manufacturing




 PSR-4000PF9L
www.DataSheet42U/.4com
DATA SHEET
PSR-4000 PF9L
/CA-40 PF9
3. PROCESS CONDITION
PROCESS
PWB
FR – 4 , 1.6 mm
Pre-treatment
Acid treatment brushing
RANGE
Printing
100 mesh-count
90 ~ 125 mesh
Hold time
Tack free
Exposure
Hold time
Development
10 min
Both sides simultaneous exposure
1 st printing : 80 / 15 min
2nd printing : 80 / 25 min
( Hot air convention oven )
Single side exposure
80 / 30 min ( Hot air convection oven )
400 mJ/cm2 ( on the solder mask )
10 ~ 20 min
80 / 10~20 min
80 / 20~30 min
80 / 20~40 min
300 ~ 500 mJ/cm2
10 min
Aqueous alkaline solution : 1 wt% Na2CO3
Temperature of developer : 30
Spray pressure : 0.196 MPa
Developing time : 60 sec
10 ~ 20 min
0.196 ~ 2.45 MPa
60 ~ 90 sec
Water rinse
Post cure
Temperature 25
Spray pressure 0.098 MPa
Dwelling time 45sec
80 / 30 min 110 / 30min, 150
( Hot air convection oven )
60min
30 or below
0.098~0.147Mpa
45~60 sec
4. ATTENTION ON EACH PROCESS :
As to the operation environment. It is desirable to deal with the ink under the yellow
lamps in the clean room. Please avoid using it under white fluorescent lamps or sunlight
(directly or indirectly).
The adequate thickness is 10 ~ 20 um (on the copper after curing).
Thin coating possibly reduces its solder heat resistance. On the other hand, thick coating
possibly causes the under-cut or low tackiness.
Please set the pre-cure conditions and tack free window after the confirmation test
because they are influenced according to the type of the drying machine and the quantity
of the board to be dried.




 PSR-4000PF9L
www.DataSheet43U/.4com
DATA SHEET
PSR-4000 PF9L
/CA-40 PF9
Please set the exposing energy after the confirmation test of under-cut, surface gloss,
back side exposure and so on because it is influenced according to the material of the
board, the thickness of ink, etc.
Regarding the developing process, please control the developer density, the temperature,
the spray pressure and the developer time, etc.
The inadequacy of control causes the degradation of the developability and the increase
of under-cut.
Please set the post cure conditions considering the curing time of the marking ink.
Insufficient curing or over curing may cause the degradation of properties.
5. CHARACTERISTIC
(1) TACK FREE TOLERANCE WINDOW :
Drying time
( 80 / min )
50
60
70
80
Developability
(2) PHOTO SENSITIVITY :
Item
Thickness
Sensitivity
Kodak No.2
22
(Step density tablet)
2m
Energy
200 mJ/cm2
300 mJ/cm2
400 mJ/cm2
Developing time
60 sec.
Resolution
(Between QFP)
200 mJ/cm2
40 2 m 300 mJ/cm2
400 mJ/cm2
60 sec.
The exposure energy is measured on the solder mask by using ORC
HMW-680,7Kw,metal halide lamp.
Sensitivity
5 step
6 step
7 step
50 m
50 m
50 m






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