PROCESS
Small Signal Transistor
CP336V
NPN - High Voltage Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 57,735 PRINCIPAL DEVICE TYPES CMPT5551 CTLT5551-M832D CXT5551 CZT5551 CZT5551E EPITAXIAL PLANAR 17.3 x 17.3...
