PROCESS
Small Signal Transistors
CP741V
PNP - Low VCE(SAT) Transistor Chip
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PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 54,330 PRINCIPAL DEVICE TYPES CMLT7410 CMPT7410 CMST7410 CMUT7410 EPITAXIAL PLANAR 17...