PROCESS
Small Signal MOSFET Transistor
P-Channel Enhancement-Mode Transistor Chip
CP764X
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PROCESS DETAILS Process Die Size Die Thickness Gate Bonding Pad Area Source Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 6 INCH WAFER 62,600 PRINCIPAL DEVICE TYPES CMLDM8002A CMPDM8002A CTLDM8002A-M621 EPITA...
