PWM Regulator. LX1673 Datasheet

LX1673 Regulator. Datasheet pdf. Equivalent

Part LX1673
Description High Frequency PWM Regulator
Feature LX1673 TM ® High Frequency PWM Regulator P RODUCTION D ATA S HEET DESCRIPTION KEY FEATURES WWW ..
Manufacture Microsemi Corporation
Total Page 13 Pages
Datasheet
Download LX1673 Datasheet



LX1673
LX1673
TM ® High Frequency PWM Regulator
PRODUCTION DATA SHEET
DESCRIPTION
The LX1673 is a highly integrated With onboard gate drivers, the switching
power supply controller IC featuring one PWM output is capable of sourcing up to
www.PDWataMShesetw4Uit.cnheting regulator stage with an 15A. The LX1673 also features an
additional onboard linear regulator additional Linear Regulator Controller
driver.
output, which when coupled with an
With several switching frequencies inexpensive MOSFET is capable of
available (up to 900kHz) the LX1673 supplying up to an additional 5A for I/O,
can be optimized for both cost and PCB memory, and other supplies surrounding
space. Utilizing external com- today’s microprocessor designs.
pensation, a wide selection of external Each regulator output voltage is
components can be chosen for use in programmed via a simple voltage-divider
any application while maintaining network.
stable operation.
Integrated hiccup mode current limiting
The LX1673 incorporates a fully is implemented utilizing MOSFET RDS(ON)
programmable soft-start and power impedance. This enables the LX1673 to
sequence capabilities. The LDO and monitor maximum current limit conditions
PWM have independent enable pins. without the use of expensive current sense
resistors.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
PRODUCT HIGHLIGHT
KEY FEATURES
ƒ Two Independently Regulated
Outputs
ƒ Outputs As Low As 0.8V
Generated From An Internal 1%
Reference
ƒ Integrated High Current MOSFET
Drivers
ƒ 300KHz, 600KHz, and 900KHz
High Frequency Operation
Minimizes External Component
Requirements
ƒ Soft-Start and Power Sequencing
Control
ƒ Adjustable Linear Regulator Driver
Output
ƒ No current-sense resistors
APPLICATIONS/BENEFITS
ƒ Video Card Power Supplies
ƒ PC Peripherals
ƒ Computer Add-On Cards
ƒ 3.3V Power Conversion
ƒ DDR Memory Termination
+3.3V
Copyright © 2004
Rev 1.0, 3/18/2005
PWRGD
+3.3V
VOUT2
LDDIS
DIS
+5V
+12V
20 19 18 17 16
LDVCC PWGD VC1 TDRV PGND
1 15
LDGD
BDRV
2
LDFB
14
VCCL
3
LDDIS
4
DGND
LX1673
13
VCC
12
VS
5
AGND
11
CS
DIS SS EA+ EA- EAO
6 7 8 9 10
+5V
+5V
VOUT1
PACKAGE ORDER INFO
TA (°C)
PW LQSwitching
Frequency (kHz)
Plastic TSSOP
20-Pin
RoHS Compliant / Pb-free
Plastic MLPQ
20-Pin
RoHS Compliant / Pb-free
-40 to 85
300
LX1673-03CPW
LX1673-03CLQ
-40 to 85
-40 to 85
600
LX1673-06CPW
LX1673-06CLQ
900
LX1673-09CPW
LX1673-09CLQ
Note: Available in Tape & Reel. Append the letters “TR” to the part number. (i.e. LX1673-03CPW-TR)
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1



LX1673
LX1673
TM ® High Frequency PWM Regulator
PRODUCTION DATA SHEET
ABSOLUTE MAXIMUM RATINGS
Supply Voltage (VCC) DC ................................................................-0.3V to 5.5V
Supply Voltage (VCC) Transient .........................................................-0.3V to 6V
Driver Supply Voltage (VCCL) DC .....................................................-0.3V to 13V
Driver Supply Voltage (VCCL) Transient............................................-0.3V to 16V
Driver Supply Voltage (VC1) DC .......................................................-0.3V to 19V
Input Voltage (SS/DIS) .....................................................................-0.3V to 5.5V
Output Drive Peak Current Source (HO, LO).......................................1A (500ns)
Output Drive Peak Current Sink (HO, LO) ..........................................1A (500ns)
Operating Temperature Range .........................................................-40°C to 85°C
Maximum Operating Junction Temperature ................................................ 150°C
Storage Temperature Range...........................................................-65°C to 150°C
Lead Temperature (Soldering 180 seconds) ................................................ 235°C
Package Peak Temp. for Solder Reflow (40 Seconds Maximum Exposure).. 260°C(+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
The limitation on transient time is thermal and is due to zener diodes on the supply
pins, application of maximum voltages will increase current into that pin and
increase package power dissipation.
THERMAL DATA
PW Plastic TSSOP 20-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
90°C/W
LQ Plastic MLPQ 20-Pin
THERMAL RESISTANCE-JUNCTION TO AMBIENT, θJA
35°C/W
Junction Temperature Calculation: TJ = TA + (PD x θJC).
The θJA numbers are guidelines for the thermal performance of the device/pc-board system.
All of the above assume no airflow.
PACKAGE PIN OUT
LDGD 1
LDFB
LDDIS
DGND
AGND
6
16
BDRV
VCCL
VCC
VS
11 CS
LQ PACKAGE
(Top View)
N.C. – No Internal Connection
N/U – Not Used
RSVD – Do Not Use
VC1
PGOOD
LDOVCC
LDGD
LDFB
LDDIS
DGND
AGND
DIS
SS
1
10
20 TDRV
PGND
BDRV
VCCL
VCC
VS
CS
EAO
EA-
11 EA+
PW PACKAGE
(Top View)
Pb-free 100% Matte Tin Lead Finish
Copyright © 2004
Rev 1.0, 3/18/2005
Microsemi
Integrated Products Division
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2





@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)