Front-End Module. LX5543 Datasheet

LX5543 Module. Datasheet pdf. Equivalent

Part LX5543
Description 2.4-2.5 GHz Front-End Module
Feature LX5543 TM ® 2.4-2.5 GHz Front-End Module with Internally Matched Power Amplifier and SP3T Switch P .
Manufacture Microsemi Corporation
Total Page 3 Pages
Datasheet
Download LX5543 Datasheet



LX5543
LX5543
TM ® 2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier and SP3T Switch
PRODUCTION DATA SHEET
DESCRIPTION
LX5543 is a WLAN front-end provides about 25dB power gain, and
module (FEM) for 802.11b/g/n and +17dBm linear output power, with
www.oDtahtaeSrheaept4pUl.inceat tions in the 2.4-2.5GHz EVM (<3%) for 64QAM/ 54Mbps
frequency range. LX5543 integrates OFDM. Both gain and power are
an advanced InGaP/GaAs Hetero- readily measured at antenna port, with
junction Bipolar Transistor (HBT) the insertion loss of the SP3T switch
power amplifier with on chip included.
impedance matching and a Depletion The Rx path of LX5543 features low
mode pHEMT (D-pHEMT) single- insertion loss of 0.6dB and high input
pole triple-throw (SP3T) switch in a referred 1dB gain compression point
single package with 3x3mm footprint. (IP1dB) of +25dBm. Bluetooth path of
LX5543 provides capability of sharing LX5543 features insertion loss 0.9dB,
a single antenna between WLAN and and IP1dB of +29dBm.
Bluetooth systems through the SP3T LX5543 is available in a 16-pin, low
switch.
profile of 0.55mm, 3x3mm2 micro-
The Tx path of LX5543 features a lead package (MLPQ-16L). With its
two-stage monolithic microwave high level of functional integration,
integrated circuit (MMIC) power best-class performance, compact
amplifier with active bias circuitry, footprint and low profile, LX5543
on-chip output power detector, and offers an ideal front-end solution for
50input/output matching inside the the ever demanding design require-
package. With 3.6V supply voltage ments of today’s highly integrated
and 82mA bias current, the Tx path
mobile equipments, including 802.11
b/g/n and Bluetooth applications.
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
KEY FEATURES
2.4-2.5GHz 802.11b/g/n Front-
End Solution in a Single MLP
Package
SP3T for Sharing Antenna
between WLAN and Bluetooth
systems
All RF I/O Matched to 50
Single-Supply Voltage 3.0V to
4.2V
Small Footprint: 3x3mm2
Low Profile: 0.55mm
RoHS Compliant & Pb-Free
TX Features :
Power Gain ~ 25dB*
Pout ~ +17dBm* for 3% EVM
at Antenna
Current ~145mA at +17dBm*
Pout ~ +21dBm* for 11b 1Mbps
DSSS Mask Compliance
Quiescent Current ~ 82mA
RX Features :
Insertion Loss ~ 0.6 dB
IP1dB ~ +25 dBm
Bluetooth Path :
Insertion Loss ~ 0.9 dB
IP1dB ~ +29 dBm
* Including SP3T switch loss
APPLICATIONS
IEEE 802.11b/g/n
Mobile Phone WLAN module
BLOCK DIAGRAM
Vref Vc1
PAOut/
Vc2 SwIn
TxIn
Det
RxOut
IMN*
PA
BT
*IMN:
Input Matching Network
*OMN:
Output Matching Network
OMN*
Antenna
Port
CtrlTx / CtrlRx / CtrlBT
Copyright 2010
Rev. 1.0, 2010-03-18
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 1



LX5543
LX5543
TM ® 2.4-2.5 GHz Front-End Module with Internally
Matched Power Amplifier and SP3T Switch
PRODUCTION DATA SHEET
PRODUCT HIGHLIGHT
MSC
555423
891383A
PACKAGE ORDER INFO
Plastic MLPQ
16 pin 3x3mm
LU RoHS Compliant /Pb-Free
LX5543LU
Note: Available in Tape & Reel.
Append the letters “TR” to the part number.
(i.e. LX5543LU-TR)
ABSOLUTE MAXIMUM RATINGS
DC Supply Voltage, RF off ...............................................................................5V
Collector Current (PA)................................................................................500mA
Total Power Dissipation....................................................................................2W
RF Input Power (TxIn)..............................................................................+10dBm
RF Input Power (Ant, SwIn, BT)..............................................................+25dBm
Maximum Junction Temperature (Tj max) ................................................ +150°C
Operation Ambient Temperature ...................................................-40°C to +85°C
Storage Temperature ....................................................................-65°C to +150°C
RoHS/Pb-Free Peak Package Temp. for Solder Reflow
(40 seconds maximum exposure)................................................... 260°C (+0, -5)
Note: Exceeding these ratings could cause damage to the device. All voltages are with respect to
Ground. Currents are positive into, negative out of specified terminal.
THERMAL DATA
LU Plastic MLPQ 16-Pin
THERMAL RESISTANCE-JUNCTION TO CASE, JC
THERMAL RESISTANCE-JUNCTION TO AMBIENT, JA
10 C/W
50 C/W
Junction Temperature Calculation: TJ = TA + (PD x JA).
The JA numbers are guidelines for the thermal performance of the device/pc-board system. All of the
above assume no ambient airflow.
PACKAGE PIN OUT
TxIn NC Vc1 Vc2
Vcc
Vref
Det
RxOut
16 15 14 13
1 12
2 11
3 10
4
GND
9
5678
PAOut
SwIn
CtrlRx
CtrlTx
NC BT CtrlBT Ant
LU PACKAGE
(“See-Through” View from Top)
RoHS/Pb-free 100% Matte Tin Lead finish
Copyright 2010
Rev. 1.0, 2010-03-18
Microsemi
Analog Mixed Signal Group
11861 Western Avenue, Garden Grove, CA. 92841, 714-898-8121, Fax: 714-893-2570
Page 2





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