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GS8170DD36C-200

GSI Technology
Part Number GS8170DD36C-200
Manufacturer GSI Technology
Description Double Data Rate SigmaRAM
Published Apr 20, 2012
Detailed Description GS8170DD36C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp Features • Double Data Rate Read and Write mode...
Datasheet PDF File GS8170DD36C-200 PDF File

GS8170DD36C-200
GS8170DD36C-200

Overview
GS8170DD36C-333/300/250/200 209-Bump BGA Commercial Temp Industrial Temp Features • Double Data Rate Read and Write mode • Late Write; Pipelined read operation • JEDEC-standard SigmaRAM™ pinout and package • 1.
8 V +150/–100 mV core power supply • 1.
8 V CMOS Interface • ZQ controlled user-selectable output drive strength • Dual Cycle Deselect • Burst Read and Write option • Fully coherent read and write pipelines • Echo Clock outputs track data output drivers • 2 user-programmable chip enable inputs • IEEE 1149.
1 JTAG-compliant Serial Boundary Scan • 209-bump, 14 mm x 22 mm, 1 mm bump pitch BGA package • Pin-compatible with future 36Mb, 72Mb, and 144Mb devices 18Mb Σ1x2Lp CMOS I/O Double Dat...


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