PROCESS
Schottky Rectifier
CPD85V
1 Amp Schottky Barrier Rectifier Chip
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 39.4 x 39.4 MILS 7.1 MILS 35 x 35 MILS Al - 30,000Å Au - 12,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER
10,900
PRINCIPAL DEVICE TYPES CMPSH1-4L
R1 (22-M...