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Package information. SOT23-6 Datasheet

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Package information. SOT23-6 Datasheet






SOT23-6 information. Datasheet pdf. Equivalent




SOT23-6 information. Datasheet pdf. Equivalent





Part

SOT23-6

Description

Package information



Feature


Package information - SOT23-6 Surface mo unted, 6 pin package Package outline D IM A A1 A2 b C D E E1 L e e1 L Min. 0.9 0 0.00 0.90 0.35 0.09 2.70 2.20 1.30 0. 10 Millimeters Max. 1.45 0.15 1.30 0.5 0 0.26 3.10 3.20 1.80 0.60 0.95 REF 1.9 0 REF 0° 30° 0° Min. 0.0354 0.00 0.0 354 0.0078 0.0035 0.1062 0.0866 0.0511 0.0039 Inches Max. 0.0570 0.0059 0.051 1 0.0196 0.0102 0.122.
Manufacture

ZETEX

Datasheet
Download SOT23-6 Datasheet


ZETEX SOT23-6

SOT23-6; 0 0.1181 0.0708 0.0236 0.0374 REF 0.0748 REF 30° Note: Controlling dimensions are in millimeters. Approximate dimens ions are provided in inches 0.95 0.037 1.06 0.042 2.2 0.087 0.65 0.026 mm i nches Issue 4 - November 2007 © Zetex Semiconductors plc 2007 1 www.zetex. com Nominal weight Nominal weight per device 18mg. Tape and reel information Orientation Tape wi.


ZETEX SOT23-6

dth (mm) Reel size (inches) No. of compo nents 3,000 Pin 1 Tape option indicato r TA TC 8 13 10,000 Embossed carrie r tape configuration P0 K t Top cover t ape D P2 10 pitches culmulative tole rance on tape ±0.2mm (±0.008”) E S ee Note 1 A0 See Note 1 F W B1 K0 See Note 1 B0 P Embossment Center line s of cavity D1 User direction of feed 8 A0, B0, K0 B1 (max.


ZETEX SOT23-6

.) D D1 (max.) E F P See note* 4.55 (0.1 79) 1.50 + 0.10 - 0.00 1.00 (0.039) 1.7 5 ± 0.10 3.50 ± 0.10 (0.138 ± 0.004) 4.00 ±0.10 (0.157 ± 0.004) 12 See n ote* 8.20 (0.323) 1.50 + 0.10 - 0.00 1. 50 (0.059) 1.75 ± 0.10 5.50 ± 0.05 (0 .217 ± 0.002) 4.00 ±0.10 (0.157 ± 0. 004) 8.00 ±0.10 (0.315 ± 0.004) 16 S ee note* 12.10 (0.476) 1.50 + 0.10 - 0. 00 1.50 (0.059) 1.75 ± 0.10 7..

Part

SOT23-6

Description

Package information



Feature


Package information - SOT23-6 Surface mo unted, 6 pin package Package outline D IM A A1 A2 b C D E E1 L e e1 L Min. 0.9 0 0.00 0.90 0.35 0.09 2.70 2.20 1.30 0. 10 Millimeters Max. 1.45 0.15 1.30 0.5 0 0.26 3.10 3.20 1.80 0.60 0.95 REF 1.9 0 REF 0° 30° 0° Min. 0.0354 0.00 0.0 354 0.0078 0.0035 0.1062 0.0866 0.0511 0.0039 Inches Max. 0.0570 0.0059 0.051 1 0.0196 0.0102 0.122.
Manufacture

ZETEX

Datasheet
Download SOT23-6 Datasheet




 SOT23-6
Package information - SOT23-6
Surface mounted, 6 pin package
Package outline
DIM Millimeters
Inches
Min.
Max.
Min.
Max.
A
0.90
1.45
0.0354
0.0570
A1 0.00 0.15 0.00 0.0059
A2
0.90
1.30
0.0354
0.0511
b
0.35
0.50
0.0078
0.0196
C
0.09
0.26
0.0035
0.0102
D
2.70
3.10
0.1062
0.1220
E
2.20
3.20
0.0866
0.1181
E1
1.30
1.80
0.0511
0.0708
L
0.10
0.60
0.0039
0.0236
e 0.95 REF
0.0374 REF
e1 1.90 REF
0.0748 REF
L 0° 30° 0° 30°
Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches
2.2
0.087
0.95
0.037
1.06
0.042
0.65
0.026
mm
inches
Issue 4 - November 2007
© Zetex Semiconductors plc 2007
1
www.zetex.com




 SOT23-6
Nominal weight
Nominal weight per device 18mg.
Tape and reel information
Orientation
Tape width
(mm)
Reel size
(inches)
No. of
components
3,000
Pin 1 8 13 10,000
Embossed carrier tape configuration
K
t
Top cover
tape
P0
D P2
See Note 1
A0
See Note 1
10 pitches culmulative
tolerance on tape
±0.2mm (±0.008”)
E
FW
B1 K0
See Note 1
B0
Embossment
P
User direction of feed
Center lines
of cavity
D1
Tape option
indicator
TA
TC
A0, B0, K0
B1 (max.)
D
D1 (max.)
E
F
P
P0
P2
t (max.)
W
8
See note*
4.55 (0.179)
1.50 + 0.10 - 0.00
1.00 (0.039)
1.75 ± 0.10
3.50 ± 0.10
(0.138 ± 0.004)
4.00 ±0.10
(0.157 ± 0.004)
4.00 ± 0.10
2.00 ± 0.05
0.40
8.00 (0.315)
12
See note*
8.20 (0.323)
1.50 + 0.10 - 0.00
1.50 (0.059)
1.75 ± 0.10
5.50 ± 0.05
(0.217 ± 0.002)
4.00 ±0.10
(0.157 ± 0.004)
8.00 ±0.10
(0.315 ± 0.004)
4.00 ± 0.10
2.00 ± 0.05
0.40
12.00 ± 0.30
(0.472 ± 0.012)
16
See note*
12.10 (0.476)
1.50 + 0.10 - 0.00
1.50 (0.059)
1.75 ± 0.10
7.50 ± 0.10
(0.295 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
8.00 ±0.10
(0.315 ± 0.004)
12.00 ± 0.10
(0.472 ± 0.004)
4.00 ± 0.10
2.00 ± 0.05
0.40
16.30 (0.642)
24
See note*
20.10 (0.791)
1.50 + 0.10 - 0.00
1.50 (0.059)
1.75 ± 0.10
11.50 ± 0.10
(0.453 ± 0.004)
4.00 ± 0.10
(0.157 ± 0.004)
to 20.00 ± 0.10
(0.787 ± 0.004)
in 4.00 (0.157)
increments
4.00 ± 0.10
2.00 ± 0.05
0.40
24.30 (0.957)
NOTES:
A0, B0 and K0 dimensions are determined with respect to EIA/JEDEC rotational and lateral movement requirements
(see fig. 1).
Issue 3 - March 2007
© Zetex Semiconductors plc 2007
2
www.zetex.com




 SOT23-6
0.5mm
maximum
0.5mm
maximum
20° maximum
Component
cavity
center line
B0
20° maximum
Component
center line
A0
Sketch A (top view)
Component lateral movement
Sketch B (side or front sectional view)
Component rotation - side view
Sketch C (top view)
Component rotation - top view
Figure 1 - rotational and lateral movement
Reel configuration
Tape slot in core
for tape start.
2.5mm min. width,
10mm min. depth
B
T
AD
NC
Tape option
A max.
Full radius
B min.
G
C
D min.
N min.
Tape size
G
T max.
24.4 - 26.4 (0.96 – 1.039)
30.4 (1.197)
This publication is issued to provide outline information only which (unless agreed by the company in writing) may not be used, applied or
reproduced for any purpose or form part of any order or contact or be regarded as a representation relating to the products or services concerned.
The company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service.
© Zetex Semiconductors plc 2007



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