HC5513 SLIC Datasheet

HC5513 Datasheet, PDF, Equivalent


Part Number

HC5513

Description

TR909 DLC/FLC SLIC

Manufacture

Intersil Corporation

Total Page 18 Pages
Datasheet
Download HC5513 Datasheet


HC5513
Data Sheet
HC5513
October 1998 File Number 3963.10
TR909 DLC/FLC SLIC with
Low Power Standby
The HC5513 is a subscriber line interface circuit which is
interchangeable with Ericsson’s PBL3764 for distributed
central office applications. Enhancements include immunity
to circuit latch-up during hot plug and absence of false
signaling in the presence of longitudinal currents.
The HC5513 is fabricated in a High Voltage Dielectrically
Isolated (DI) Bipolar Process that eliminates leakage
currents and device latch-up problems normally associated
with Junction Isolated (JI) ICs. The elimination of the
leakage currents results in improved circuit performance for
wide temperature extremes. The latch free benefit of the DI
xxprocess guarantees operation under adverse transient
conditions. This process feature makes the HC5513 ideally
suited for use in harsh outdoor environments.
Ordering Information
PART
NUMBER
HC5513BIM
HC5513BIP
TEMP. RANGE
(oC)
PACKAGE
-40 to 85 28 Ld PLCC
-40 to 85 22 Ld PDIP
PKG. NO.
N28.45
E22.4
Block Diagram
Features
• DI Monolithic High Voltage Process
• Programmable Current Feed (20mA to 60mA)
• Programmable Loop Current Detector Threshold and Bat-
tery Feed Characteristics
• Ground Key and Ring Trip Detection
• Compatible with Ericsson’s PBL3764
• Thermal Shutdown
• On-Hook Transmission
• Wide Battery Voltage Range (-24V to -58V)
• Low Standby Power
• Meets TR-NWT-000057 Transmission Requirements
• -40oC to 85oC Ambient Temperature Range
Applications
• Digital Loop Carrier Systems . . . . . . . . . . . . . . • Pair Gain
• Fiber-In-The-Loop ONUs . . . . . . . . . . . . . . . . . . . • POTS
• Wireless Local Loop . . . . . . . . . . . . . . . . . . . . . . . .• PABX
• Hybrid Fiber Coax
• Related Literature
- AN9537, Operation of the HC5513/26 Evaluation Board
RINGRLY
DT
DR
TIP
RING
HPT
HPR
RING RELAY
DRIVER
RING TRIP
DETECTOR
2-WIRE
INTERFACE
VBAT
VCC
VEE
AGND
BGND
BIAS
LOOP CURRENT
DETECTOR
GROUND KEY
DETECTOR
4-WIRE
INTERFACE
VF SIGNAL
PATH
DIGITAL
MULTIPLEXER
VTX
RSN
E0
E1
C1
C2
DET
RD
RDC
RSG
54 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207 | Copyright © Intersil Corporation 1999

HC5513
HC5513
Absolute Maximum Ratings
Operating Temperature Range . . . . . . . . . . . . . . . . -40oC to 110oC
Power Supply (-40oC TA 85oC)
Supply Voltage VCC to GND . . . . . . . . . . . . . . . . . . . . 0.5V to 7V
Supply Voltage VEE to GND. . . . . . . . . . . . . . . . . . . . . -7V to 0.5V
Supply Voltage VBAT to GND . . . . . . . . . . . . . . . . . . . -70V to 0.5V
Ground
Voltage between AGND and BGND . . . . . . . . . . . . . -0.3V to 0.3V
Relay Driver
Ring Relay Supply Voltage . . . . . . . . . . . . . . . . . 0V to VBAT 75V
Ring Relay Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50mA
Ring Trip Comparator
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VBAT to 0V
Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -5mA to 5mA
Digital Inputs, Outputs (C1, C2, E0, E1, DET)
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0V to VCC
Output Voltage (DET Not Active) . . . . . . . . . . . . . . . . . .0V to VCC
Output Current (DET) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA
Tipx and Ringx Terminals (-40oC TA 85oC)
Tipx or Ringx Voltage, Continuous (Referenced to GND) .VBAT to 2V
Tipx or Ringx, Pulse < 10ms, TREP > 10s . . . . . .VBAT -20V to 5V
Tipx or Ringx, Pulse < 10µs, TREP > 10s . . . . VBAT -40V to 10V
Tipx or Ringx, Pulse < 250ns, TREP > 10s. . . . VBAT -70V to 15V
Tipx or Ringx Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70mA
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . . .500V
Thermal Information
Thermal Resistance (Typical, Note 1)
θJAoC/W
22 Lead PDIP Package . . . . . . . . . . . . . . . . . . . . . . .
53
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . .
Continuous Dissipation at 70oC
53
22 Lead PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W
28 Lead PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5W
Package Power Dissipation at 70oC, t < 100ms, tREP > 1s
22 Lead PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4W
28 Lead PLCC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4W
Derate above . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70oC
Plastic DIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . 18.8mW/oC
PLCC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18.8mW/oC
Maximum Junction Temperature Range . . . . . . . . . -40oC to 150oC
Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . .300oC
(PLCC - Lead Tips Only)
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . .543 Transistors, 51 Diodes
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on an evaluation PC board in free air.
Typical Operating Conditions
These represent the conditions under which the part was developed and are suggested as guidelines.
PARAMETER
Case Temperature
VCC with Respect to AGND
VEE with Respect to AGND
VBAT with Respect to BGND
CONDITIONS
-40oC to 85oC
-40oC to 85oC
-40oC to 85oC
MIN TYP MAX
-40 - 100
4.75 - 5.25
-5.25 - -4.75
-58 - -24
UNITS
oC
V
V
V
Electrical Specifications
TA = -40oC to 85oC, VCC = 5V ±5%, VEE = -5V ±5%, VBAT = -28V, AGND = BGND = 0V, RDC1 = RDC2 =
41.2k, RD = 39k, RSG = , RF1 = RF2 = 0, CHP = 10nF, CDC = 1.5µF, ZL = 600, Unless Otherwise
Specified. All pin number references in the figures refer to the 28 lead PLCC package.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
Overload Level
Longitudinal Impedance (Tip/Ring)
1% THD, ZL = 600, (Note 2, Figure 1)
0 < f < 100Hz (Note 3, Figure 2)
3.1 -
- VPEAK
- 20 35 /Wire
RL
600
IDCMET
23mA
TIP
27
VTRO
VTX
19
RING
28
RSN
16
RT
600k
RRX
ERX
300k
FIGURE 1. OVERLOAD LEVEL (TWO-WIRE PORT)
1VRMS
0 < f < 100Hz
EL C
AT TIP
300
27
VT
2.16µF
300
AR
VR
RING
28
LZT = VT/AT
VTX
19
RT
600k
RSN
16
RRX
300k
LZR = VR/AR
FIGURE 2. LONGITUDINAL IMPEDANCE
55


Features HC5513 Data Sheet October 1998 File Numb er 3963.10 TR909 DLC/FLC SLIC with Low Power Standby The HC5513 is a subscrib er line interface circuit which is inte rchangeable with Ericsson’s PBL3764 f or distributed central office applicat ions. Enhancements include immunity to circuit latch-up during hot plug and ab sence of false signaling in the presenc e of longitudinal currents. The HC5513 is fabricated in a High Voltage Dielect rically Isolated (DI) Bipolar Process t hat eliminates leakage currents and dev ice latch-up problems normally associat ed with Junction Isolated (JI) ICs. The elimination of the leakage currents re sults in improved circuit performance f or wide temperature extremes. The latch free benefit of the DI xxprocess guar antees operation under adverse transien t conditions. This process feature make s the HC5513 ideally suited for use in harsh outdoor environments. Features DI Monolithic High Voltage Process Programmable Current Feed (20mA to 60mA) • Programmable Loop Current D.
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