LCD Module. M215HGE-L21 Datasheet

M215HGE-L21 Module. Datasheet pdf. Equivalent

Part M215HGE-L21
Description TFT LCD Module
Feature PRODUCT SPECIFICATION Doc. Number : Tentative Specification Preliminary Specification Approval Spec.
Manufacture Chi Mei
Datasheet
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PRODUCT SPECIFICATION Doc. Number : Tentative Specification M215HGE-L21 Datasheet
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M215HGE-L21
PRODUCT SPECIFICATION
Doc. Number :
Tentative Specification
Preliminary Specification
Approval Specification
MODEL NO.: M215HGE
SUFFIX: L21
Customer: Common Model
APPROVED BY
SIGNATURE
Name / Title
Note
Product version C1/C2
Please return 1 copy for your confirmation with your
signature and comments.
Approved By Checked By
Prepared By
Version 3.3
29 February 2012
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited.
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M215HGE-L21
PRODUCT SPECIFICATION
CONTENTS
1. GENERAL DESCRIPTION ......................................................................................................5
1.1 OVERVIEW........................................................................................................................5
1.2 GENERAL SPECIFICATIONS ...........................................................................................5
2. MECHANICAL SPECIFICATIONS...........................................................................................5
3. ABSOLUTE MAXIMUM RATINGS ..........................................................................................5
3.1 ABSOLUTE RATINGS OF ENVIRONMENT ......................................................................5
3.2 ELECTRICAL ABSOLUTE RATINGS ................................................................................6
3.2.1 TFT LCD MODULE .................................................................................................... 6
3.2.2 BACKLIGHT UNIT...................................................................................................... 6
4. ELECTRICAL SPECIFICATIONS ............................................................................................7
4.1 FUNCTION BLOCK DIAGRAM..........................................................................................7
4.2. INTERFACE CONNECTIONS ..........................................................................................7
4.3 ELECTRICAL CHARACTERISTICS ..................................................................................9
4.3.1 LCD ELETRONICS SPECIFICATION ........................................................................ 9
4.3.2 Vcc Power Dip Condition...........................................................................................11
4.3.3 BACKLIGHT UNIT.....................................................................................................11
4.3.4 LIGHTBAR Connector Pin Assignment .................................................................... 12
4.4 LVDS INPUT SIGNAL SPECIFICATIONS........................................................................13
4.4.1 LVDS DATA MAPPING TABLE ................................................................................. 13
4.4.2 COLOR DATA INPUT ASSIGNMENT....................................................................... 14
4.5 DISPLAY TIMING SPECIFICATIONS ..............................................................................15
5. OPTICAL CHARACTERISTICS ............................................................................................18
5.1 TEST CONDITIONS ........................................................................................................18
5.2 OPTICAL SPECIFICATIONS ...........................................................................................18
6. RELIABILITY TEST ITEM......................................................................................................21
7. PACKING ...............................................................................................................................22
7.1 PACKING SPECIFICATIONS ..........................................................................................22
7.2 PACKING METHOD.........................................................................................................22
7.3 PALLET............................................................................................................................23
8. CMI MODULE LABEL ...........................................................................................................24
9. PRECAUTIONS .....................................................................................................................25
9.1 ASSEMBLY AND HANDLING PRECAUTIONS................................................................25
9.2 STORAGE PRECAUTIONS.............................................................................................25
9.3 OPERATION PRECAUTIONS .........................................................................................25
9.4 SAFETY PRECAUTIONS ................................................................................................26
Version 3.3
29 February 2012
The copyright belongs to CHIMEI InnoLux. Any unauthorized use is prohibited.
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