Preliminary THGBM5G6A2JBAIR
8GB THGBM5G6A2JBAIR INTRODUCTION
TOSHIBA e-MMC Module
THGBM5G6A2JBAIR is 8-GByte density of e-MMC Module product housed in 153 ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBM5G6A2JBAIR has an industry standard MMC protocol for easy use.
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