KLMBG8FE4B-B001 embedded MMC Datasheet

KLMBG8FE4B-B001 Datasheet, PDF, Equivalent


Part Number

KLMBG8FE4B-B001

Description

embedded MMC

Manufacture

Samsung

Total Page 30 Pages
Datasheet
Download KLMBG8FE4B-B001 Datasheet


KLMBG8FE4B-B001
SAMSUNG CONFIDENTIAL
Rev. 1.4, Jul. 2012
KLMxGxFE4B-B001
Samsung e·MMC Product family
e.MMC 4.5 Specification compatibility
SAMSUNG ELECTRONICS RESERVES THE RIGHT TO CHANGE PRODUCTS, INFORMATION AND
SPECIFICATIONS WITHOUT NOTICE.
Products and specifications discussed herein are for reference purposes only. All information discussed
herein is provided on an "AS IS" basis, without warranties of any kind.
This document and all information discussed herein remain the sole and exclusive property of Samsung
Electronics. No license of any patent, copyright, mask work, trademark or any other intellectual property
right is granted by one party to the other party under this document, by implication, estoppel or other-
wise.
Samsung products are not intended for use in life support, critical care, medical, safety equipment, or
similar applications where product failure could result in loss of life or personal or physical harm, or any
military or defense application, or any governmental procurement to which special terms or provisions
may apply.
For updates or additional information about Samsung products, contact your nearest Samsung office.
All brand names, trademarks and registered trademarks belong to their respective owners.
2012 Samsung Electronics Co., Ltd. All rights reserved.
-1-

KLMBG8FE4B-B001
KLMxGxFE4B-B001
datasheet
SAMSUNG CONFIDENTIAL
Rev. 1.4
e·MMC
Revision History
Revision No.
0.0
0.5
1.0
1.1
1.2
1.3
1.4
History
Draft Date
1. Initial issue
Sep. 29, 2011
1. Engineering Sample
2. 64GB is deleted
3. Discard Time is added in Table 10
4. Init time is changed to 3sec which is the value after partition setting in Table 44
5. Extended CSD Register values are changed in Chapter 7.4
- HPI_FEATURES is changed from 0x03 to 0x01
- DATA_TAG_SUPPORT is changed from 0x00 to 0x01
- INI_TIMEOUT_AP is changed from 0x0A to 0x1E
- TRIM_MULT is changed from 0x01 to 0x02
- SEC_ERASE_MULT is changed from 0x0A to 0x1B
- SEC_TRIM_MULT is changed from 0x0A to 0x11
- ACC_SIZE is changed from 0x05 to 0x07
- OUT_OF_INTERRUPT_TIME is changed from 0x01 to 0x02
6. Time Parameters are changed in Table 60
- Initialization time is divided into ’Normal’ and ’After partition setting’
- Write timeout is changed from 300ms to 350ms
- Erase timeout is changed from 10ms to 15ms
- Secure Erase timeout is changed from 3sec to 8sec
- Secure Trim step1 timeout is changed from 300ms to 5sec
- Trim timeout is changed from 300ms to 600ms
- Packed command timeout is changed from 300ms to 350ms
- Discard timeout is deleted
Dec. 16, 2011
1. Customer Sample
2. 16GB is deleted
3. Maximum enhanced partition size is changed in Table 47
4. Performance is updated with measured value in Table 54
5. Extended CSD Register values are changed in Chapter 7.4
- HC_WP_GRP_SIZE is changed from 0x40 to 0x50
- MAX_ENH_SIZE_MULT is changed from 0x1D1 to 0x174
Jan. 16, 2012
1. Read Timeout Typo is corrected in Table 60
Feb. 09 ,2012
1. Typo of default Boot Area Partition size is corrected in Chapter 6.1.1.1
[512KB -> 2,048KB]
Mar. 12, 2012
1. 16GB and 64GB products are added
2. ’Dual Data Rate mode is supported’ is added in Chapter 2.0
3. List of interruptible command is changed in Table 28
4. Information of Wear Leveling is deleted in Chapter 6.1.4
5. Information of 'End of Life Management' is deleted in Chapter 6.1.7
6. Information of Smart Report is deleted in Chapter 6.2
May. 11, 2012
1. Maximum Enhanced Partition Size of 16GB is changed in Table 46
2. User Density Size of 16GB is changed in Table 47
3. Extended CSD Register values are changed in Chapter 7.4
- SEC_COUNT of 16GB is changed from 0x1D5A000 to 0x1D1F000
- MAX_ENH_SIZE_MULT of 16GB is changed from 0xBB to 0xBA
Jul.20, 2012
Remark
Target
Preliminary
Final
Final
Final
Final
Final
Editor
S.M.Lee
S.M.Lee
S.M.Lee
S.M.Lee
S.M.Lee
S.M.Lee
S.M.Lee
-2-


Features SAMSUNG CONFIDENTIAL Rev. 1.4, Jul. 2012 KLMxGxFE4B-B001 Samsung e·MMC Product family e.MMC 4.5 Specification compati bility datasheet SAMSUNG ELECTRONICS RE SERVES THE RIGHT TO CHANGE PRODUCTS, IN FORMATION AND SPECIFICATIONS WITHOUT NO TICE. Products and specifications discu ssed herein are for reference purposes only. All information discussed herein is provided on an "AS IS" basis, withou t warranties of any kind. This document and all information discussed herein r emain the sole and exclusive property o f Samsung Electronics. No license of an y patent, copyright, mask work, tradema rk or any other intellectual property r ight is granted by one party to the oth er party under this document, by implic ation, estoppel or otherwise. Samsung p roducts are not intended for use in lif e support, critical care, medical, safe ty equipment, or similar applications w here product failure could result in lo ss of life or personal or physical harm , or any military or defense application, or any governmental pr.
Keywords KLMBG8FE4B-B001, datasheet, pdf, Samsung, embedded, MMC, LMBG8FE4B-B001, MBG8FE4B-B001, BG8FE4B-B001, KLMBG8FE4B-B00, KLMBG8FE4B-B0, KLMBG8FE4B-B, Equivalent, stock, pinout, distributor, price, schematic, inventory, databook, Electronic, Components, Parameters, parts, cross reference, chip, Semiconductor, circuit, Electric, manual, substitute




@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)