high-speed MCU. RISE3301 Datasheet

RISE3301 MCU. Datasheet pdf. Equivalent

Part RISE3301
Description high-speed MCU
Feature RISE3301 Version 1.0 () RISE3301 RISE3301 .....................................................
Manufacture RISECOMM
Datasheet
Download RISE3301 Datasheet



RISE3301
RISE3301 数据手册
Version 1.0
瑞斯康微电子(深圳)有限公司



RISE3301
RISE3301 数据手册
目录
第一章 RISE3301 概述 ............................................................................................................3
1.1 RISE3301 的主要特点 ................................................................................................3
1.2 芯片内部功能模块框图 ...............................................................................................3
第二章 引脚定义.......................................................................................................................4
2.1 引脚分类.......................................................................................................................4
2.2 引脚功能描述 ...............................................................................................................5
第三章 片外静态存储器及片内静态存储器接口 .................................................................10
3.1 程序存储器配置 .........................................................................................................10
3.2 数据存储器配置 .........................................................................................................11
3.3 片内数据存储器 .........................................................................................................14
3.4 片内的 SRAM ............................................................................................................16
3.5 Mail Box 功能说明 ...................................................................................................17
第四章 电力载波发送和接收模块 .........................................................................................18
4.1 RISE3301 载波发送模块原理及特性.......................................................................18
4.2 RISE3301 载波接收模块原理及特性.......................................................................19
第五章 系统时钟.....................................................................................................................20
5.1 描述..................................................................................................................................20
第六章 中 断.........................................................................................................................20
第七章 GPIO 口定义..............................................................................................................21
7.1 GPIO 口描述..............................................................................................................21
7.2 复用口介绍.................................................................................................................21
7.3 GPIO 口寄存器............................................................................................................22
第八章 通讯口/Timer 功能 ....................................................................................................24
8.1 UART .....................................................................................................................24
8.2 I2C 通讯口 ..................................................................................................................24
8.3 SPI 通讯口..................................................................................................................30
8.4 Timer 定时器 ............................................................................................................34
第九章 内部 RTC ...................................................................................................................35
9.1 硬件原理.....................................................................................................................35
9.2 功能描述.....................................................................................................................35
9.3 工作寄存器.................................................................................................................36
第十章 RESET........................................................................................................................40
10.1 外围硬件复位...............................................................................................................40
10.2 底层软件控制复位 .......................................................................................................40
10.3 WDT 复位........................................................................................................................41
10.4 复位寄存器...................................................................................................................41
第十一章 电气特性.....................................................................................................................43
11.1 工作参数.......................................................................................................................43
11.2 极限参数.......................................................................................................................43
11.3 DC 特性 ........................................................................................................................43
11.4 时序特性.......................................................................................................................44
第十二章 封装参数.....................................................................................................................48
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