SDRAM MODULE. V826632K24SA Datasheet

V826632K24SA MODULE. Datasheet pdf. Equivalent

Part V826632K24SA
Description 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE
Feature V826632K24SA 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM MODULE Features ■ 184 Pin Unbuffered 33.
Manufacture ProMOS TECHNOLOGIES
Datasheet
Download V826632K24SA Datasheet

V826632K24SA 32M x 64 HIGH PERFORMANCE UNBUFFERED DDR SDRAM V826632K24SA Datasheet
Recommendation Recommendation Datasheet V826632K24SA Datasheet





V826632K24SA
V826632K24SA
32M x 64 HIGH PERFORMANCE
UNBUFFERED DDR SDRAM MODULE
Features
184 Pin Unbuffered 33,554,432 x 64 bit
Organization DDR SDRAM Modules
Utilizes High Performance 32M x 8 DDR
SDRAM in TSOPII-66 Packages
Single +2.5V (± 0.2V) Power Supply
Single +2.6V (± 0.1V) Power Supply for DDR400
Programmable CAS Latency, Burst Length, and
Wrap Sequence (Sequential & Interleave)
Auto Refresh (CBR) and Self Refresh
All Inputs, Outputs are SSTL-2 Compatible
8192 Refresh Cycles every 64 ms
Serial Presence Detect (SPD)
DDR SDRAM Performance
Component Used D3 C0 B1 B0
tCK Clock Frequency
200
166
143 133
(max.)
(PC400) (PC333) (PC266A) (PC266B)
Module Speed
D0
tAC
Clock Cycle Time
6
CAS CLaloteckncFyre=q2u.e5ncy (max.)
6
7 7.5
200
(PC400A)
tAC ClockCCloycckleCTyicmleeTime C5AS Laten-cy = 2 -
tCCKAS
Latency = 3
Clock Cycle
Time
CAS
Latency
=
2.5
-7.5
5
Clock Cycle Time CAS Latency = 3
5
tRCD tRCD parameter
tRP tRP parameter
3
3
Description
The V826632K24SA memory module is
organized 33,554,432 x 64 bits in a 184 pin memory
module. The 32M x 64 memory module uses 8
ProMOS 32M x 8 DDR SDRAM. The x64 modules
are ideal for use in high performance computer
systems where increased memory density and fast
access times are required.
D3
200
(PC400B)
7.5
6
5
3
3
C0
166
(PC333)
7.5
6
-
3
3
B1
143
(PC266A)
7.5
7
-
2
2
B0
133
(PC266B)
10
7.5
-
3
3
Units
MHz
ns
ns
ns
CLK
CLK
V826632K24SA Rev. 1.3 April 2006
1



V826632K24SA
ProMOS TECHNOLOGIES
V826632K24SA
Part Number Information
12
V8
ProMOS
TYPE
8 : DDR
VOLTAGE
2 : 2.5V
3 45
67
8
2 66 32 K
DATA
DEPTH
16 : 16Mb
32 : 32 Mb
64 : 64 Mb
65 : 128 Mb
66 : 256 Mb
9 10
24
REFRESH
RATE
0: 4K
2: 8K
DATA WIDTH
& COMP DENSITY
65 X64 using 128M
66 X64 using 256M
67 X64 using 512M
68 X64 using 1G
69 X64 using 2G
73 X72 using 128M
74 X72 using 256M
75 X72 using 512M
76 X72 using 1G
77 X72 using 2G
BANKS
4 : 4 Banks
MODULE TYPE
& COMP WIDTH
BASED ON
184PIN DIMM
UNBUFFERED
X4 X16 X8
I JK
184PIN DIMM
REGISTERED
N
O
U
200PIN
SO-DIMM
172PIN
Micro-DIMM
VBG
M
11 12
SA
13
I
COMPONENT
REV LEVEL
14 15 16 17
W - D3
PCB TYPE
G : GOLD_LEAD PLATING
W : GOLD_RoHS
L : LOW PROFILE_LEAD PLATING
X : LOW PROFILE_RoHS
COMPONENT PKG
LEAD GREEN
PLATING
TI
SJ
DN
ZP
PACKAGE
DESCRIPTION
TSOP
FBGA
Die-stacked TSOP
Die-stacked FBGA
I/O INTERFACE
SPEED
S: SSTL_2
B0 : PC2100B (133MHz @CL2.5-3-3)
B1 : PC2100A (133MHz @CL2-2-2)
C0 : PC2700 (166MHz @CL2.5-3-3)
D0 : PC3200 (200MHz @CL2.5-3-3)
D3 : PC3200 (200MHz @CL3-3-3)
*RoHS: Restriction of Hazardous Substances
*GREEN: RoHS-compliant and Halogen-Free
V826632K24SA Rev. 1.3 April 2006
2





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