LCD Module. B156XTN04.2 Datasheet

B156XTN04.2 Module. Datasheet pdf. Equivalent

Part B156XTN04.2
Description TFT LCD Module
Feature www.yslcd.com.tw Product Specification AU OPTRONICS CORPORATION ( ) Preliminary Specifications ( ).
Manufacture AUO
Datasheet
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www.yslcd.com.tw Product Specification AU OPTRONICS CORPORA B156XTN04.2 Datasheet
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B156XTN04.2
Product Specification
AU OPTRONICS CORPORATION
( ) Preliminary Specifications
( ) Final Specifications
Module
Model Name
Note ( )
15.6”HD 16:9 Color TFT-LCD with LED Backlight design
B156XTN04.2
LED Backlight with driving circuit design
Customer
Date
Approved by
Date
Checked &
Approved by
Date
Note: This Specification is subject to change
without notice.
Prepared by
Date
Justie Lee
2014/1/13
NBBU Marketing Division
AU Optronics corporation
B156XTN04.2 Document Version : 0.1
1 of 28
Studio Technology Co. Ltd. ( www.yslcd.com.tw )



B156XTN04.2
Product Specification
AU OPTRONICS CORPORATION
Contents
1. Handling Precautions .................................................................... 4
2. General Description...................................................................... 5
2.1 General Specification ................................................................................................................. 5
2.2 Optical Characteristics ............................................................................................................... 6
3. Functional Block Diagram ............................................................ 10
4. Absolute Maximum Ratings .......................................................... 11
4.1 Absolute Ratings of TFT LCD Module......................................................................................11
4.2 Absolute Ratings of Environment ............................................................................................11
5. Electrical Characteristics ............................................................. 12
5.1 TFT LCD Module ........................................................................................................................... 12
5.2 Backlight Unit................................................................................................................................ 14
6. Signal Interface Characteristic...................................................... 15
6.1 Pixel Format Image .................................................................................................................... 15
6.2 Integration Interface Requirement........................................................................................ 16
6.3 Interface Timing........................................................................................................................... 18
6.4 Power sequence:........................................................................................................................ 19
7. Panel Reliability Test ................................................................... 20
7.1 Vibration Test ................................................................................................................................ 20
7.2 Shock Test...................................................................................................................................... 20
7.3 Reliability Test ............................................................................................................................... 20
8. Mechanical Characteristics ......................................................... 21
8.1 LCM Outline Dimension............................................................................................................. 21
9. Shipping and Package................................................................ 23
9.1 Shipping Label Format .............................................................................................................. 23
9.2 Carton Package ......................................................................................................................... 24
9.3 Handling guide............................................................................................................................ 25
9.4 Shipping Package of Palletizing Sequence........................................................................ 27
10. Appendix: EDID Description ........................................................ 28
10.1 EDID Description.....................................................................................錯誤! 尚未定義書籤。
B156XTN04.2 Document Version : 0.1
2 of 28
Studio Technology Co. Ltd. ( www.yslcd.com.tw )





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