N-Channel MOSFET. APT24M80B Datasheet

APT24M80B MOSFET. Datasheet pdf. Equivalent


Microsemi APT24M80B
APT24M80B
APT24M80S
800V, 25A, 0.39Ω Max
N-Channel MOSFET
Power MOS 8is a high speed, high voltage N-channel switch-mode power MOSFET.
A proprietary planar stripe design yields excellent reliability and manufacturability. Low
switching loss is achieved with low input capacitance and ultra low Crss "Miller" capaci-
tance. The intrinsic gate resistance and capacitance of the poly-silicon gate structure
help control slew rates during switching, resulting in low EMI and reliable paralleling,
even when switching at very high frequency. Reliability in yback, boost, forward, and
other circuits is enhanced by the high avalanche energy capability.
TO-247
D3PAK
APT24M80B
APT24M80S
D
Single die MOSFET
G
S
FEATURES
• Fast switching with low EMI/RFI
• Low RDS(on)
• Ultra low Crss for improved noise immunity
• Low gate charge
• Avalanche energy rated
• RoHS compliant
TYPICAL APPLICATIONS
• PFC and other boost converter
• Buck converter
• Two switch forward (asymmetrical bridge)
• Single switch forward
• Flyback
• Inverters
Absolute Maximum Ratings
Symbol Parameter
ID
Continuous Drain Current @ TC = 25°C
Continuous Drain Current @ TC = 100°C
IDM Pulsed Drain Current 1
VGS Gate-Source Voltage
EAS Single Pulse Avalanche Energy 2
IAR Avalanche Current, Repetitive or Non-Repetitive
Thermal and Mechanical Characteristics
Symbol Characteristic
PD
RθJC
RθCS
TJ,TSTG
TL
Total Power Dissipation @ TC = 25°C
Junction to Case Thermal Resistance
Case to Sink Thermal Resistance, Flat, Greased Surface
Operating and Storage Junction Temperature Range
Soldering Temperature for 10 Seconds (1.6mm from case)
WT Package Weight
Torque Mounting Torque ( TO-247 Package), 6-32 or M3 screw
Microsemi Website - http://www.microsemi.com
Ratings
25
16
85
±30
975
12
Unit
A
V
mJ
A
Min Typ Max Unit
625 W
0.20
°C/W
0.11
-55 150
°C
300
0.22 oz
6.2 g
10 in·lbf
1.1 N·m


APT24M80B Datasheet
Recommendation APT24M80B Datasheet
Part APT24M80B
Description N-Channel MOSFET
Feature APT24M80B; APT24M80B APT24M80S 800V, 25A, 0.39Ω Max N-Channel MOSFET Power MOS 8™ is a high speed, high volta.
Manufacture Microsemi
Datasheet
Download APT24M80B Datasheet




Microsemi APT24M80B
Static Characteristics
TJ = 25°C unless otherwise specied
Symbol Parameter
Test Conditions
Min
VBR(DSS)
VBR(DSS)/TJ
RDS(on)
VGS(th)
VGS(th)/TJ
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature Coefcient
Drain-Source On Resistance 3
Gate-Source Threshold Voltage
Threshold Voltage Temperature Coefcient
VGS = 0V, ID = 250μA
Reference to 25°C, ID = 250μA
VGS = 10V, ID = 12A
VGS = VDS, ID = 1mA
800
3
IDSS Zero Gate Voltage Drain Current
VDS = 800V
VGS = 0V
TJ = 25°C
TJ = 125°C
IGSS Gate-Source Leakage Current
VGS = ±30V
Dynamic Characteristics
Symbol
gfs
Ciss
Crss
Coss
Parameter
Forward Transconductance
Input Capacitance
Reverse Transfer Capacitance
Output Capacitance
TJ = 25°C unless otherwise specied
Test Conditions
Min
VDS = 50V, ID = 12A
VGS = 0V, VDS = 25V
f = 1MHz
Co(cr) 4
Co(er) 5
Effective Output Capacitance, Charge Related
Effective Output Capacitance, Energy Related
VGS = 0V, VDS = 0V to 533V
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Current Rise Time
Turn-Off Delay Time
Current Fall Time
VGS = 0 to 10V, ID = 12A,
VDS = 400V
Resistive Switching
VDD = 533V, ID = 12A
RG = 4.7Ω 6 , VGG = 15V
APT24M80B_S
Typ Max Unit
V
0.87 V/°C
0.31 0.39
Ω
45V
-10 mV/°C
100 μA
500
±100 nA
Typ Max Unit
21 S
4595
80
455
215 pF
105
150
25 nC
75
26
38 ns
115
33
Source-Drain Diode Characteristics
Symbol Parameter
IS
Continuous Source Current
(Body Diode)
ISM
Pulsed Source Current
(Body Diode) 1
VSD Diode Forward Voltage
trr Reverse Recovery Time
Qrr Reverse Recovery Charge
dv/dt
Peak Recovery dv/dt
Test Conditions
MOSFET symbol
showing the
integral reverse p-n
junction diode
(body diode)
D
G
S
ISD = 12A, TJ = 25°C, VGS = 0V
ISD = 12A, VDD = 100V 3
diSD/dt = 100A/μs, TJ = 25°C
ISD 12A, di/dt 1000A/μs, VDD = 533V,
TJ = 125°C
Min
Typ
880
11
Max Unit
25
A
85
1.0 V
ns
μC
10 V/ns
1 Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.
2 Starting at TJ = 25°C, L = 13.54mH, RG = 10Ω, IAS = 12A.
3 Pulse test: Pulse Width < 380μs, duty cycle < 2%.
4 Co(cr) is dened as a xed capacitance with the same stored charge as COSS with VDS = 67% of V(BR)DSS.
5 Co(er) is dened as a xed capacitance with the same stored energy as COSS with VDS = 67% of V(BR)DSS. To calculate Co(er) for any value of
VDS less than V(BR)DSS, use this equation: Co(er) = 1.46E-8/VDS^2 + 1.87E-8/VDS + 7.21E-11.
6 RG is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452)
Microsemi reserves the right to change, without notice, the specications and information contained herein.



Microsemi APT24M80B
60
VGS = 10V
50
TJ = -55°C
40
TJ = 25°C
30
20
TJ = 125°C
10
TJ = 150°C
00 5 10 15 20 25 30
VDS(ON), DRAIN-TO-SOURCE VOLTAGE (V)
Figure 1, Output Characteristics
3.0
NORMALIZED TO
VGS = 10V @ 12A
2.5
2.0
1.5
1.0
0.5
0-55 -25 0 25 50 75 100 125 150
TJ, JUNCTION TEMPERATURE (°C)
Figure 3, RDS(ON) vs Junction Temperature
30
TJ = -55°C
25
TJ = 25°C
20
TJ = 125°C
15
10
5
0
0 5 10 15
ID, DRAIN CURRENT (A)
Figure 5, Gain vs Drain Current
16
ID = 12A
14
20
12
VDS = 160V
10
VDS = 400V
8
6
VDS = 640V
4
2
0
0 50 100 150 200 250
Qg, TOTAL GATE CHARGE (nC)
Figure 7, Gate Charge vs Gate-to-Source Voltage
30
TJ = 125°C
25
20
APT24M80B_S
VGS= 10, & 15V
VGS= 6, & 6.5V
5.5V
15
10 5V
5 4.5V
4V
0
0 5 10 15 20 25 30
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
Figure 2, Output Characteristics
90
VDS> ID(ON) x RDS(ON) MAX.
80 250μSEC. PULSE TEST
@ <0.5 % DUTY CYCLE
70
60
50
40 TJ = -55°C
TJ = 25°C
30
TJ = 125°C
20
10
0
0
6,000
1 2 3 4 56 7 8
VGS, GATE-TO-SOURCE VOLTAGE (V)
Figure 4, Transfer Characteristics
Ciss
1,000
100 Coss
Crss
10
0 100 200 300 400 500 600 700 800
VDS, DRAIN-TO-SOURCE VOLTAGE (V)
Figure 6, Capacitance vs Drain-to-Source Voltage
90
80
70
60
50
TJ = 25°C
40
30 TJ = 150°C
20
10
0
0 0.3 0.6 0.9 1.2 1.5
VSD, SOURCE-TO-DRAIN VOLTAGE (V)
Figure 8, Reverse Drain Current vs Source-to-Drain Voltage







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