BLE SoC. IS1870 Datasheet

IS1870 SoC. Datasheet pdf. Equivalent


Microchip IS1870
IS1870/71
Bluetooth® Low Energy (BLE) SoC
Features
• Bluetooth smart 4.2 Bluetooth Low-Energy (BLE)
compliant
• 256K bytes embedded Flash memory
• UART/SPI/I2C interface supported
• Integrated crystal oscillator, operates with 32 MHz
external crystal
• Temperature sensor supported
• Flexible 31 GPIO pins for IS1870 and 16 GPIO
pins for IS1871 configuration
• 4-channel PWM support (IS1870), 1-channel
PWM support (IS1871)
• 12 bits ADC support for battery and voltage detec-
tion. 16-channel (IS1870)/6-channel (IS1871)
• AES-CMAC hardware engine
• Beacon support
• Low-power consumption
• Peak current: Tx 13 mA, Rx 13 mA at VBAT=3.0V,
buck power
• Compact size: 4x4 mm 32QFN (IS1871) and
6x6mm 48QFN (IS1870) packages
Radio Frequency (RF)/Analog Features
• ISM band 2.402 GHz to 2.480 GHz operation
• Channels: 0-39
• Rx sensitivity: -90 dBm in BLE mode
• Tx power: +2 dBm (max)
• Received Signal Strength Indicator (RSSI) moni-
tor
Operating Conditions
• Operating voltage: 1.9V to 3.6V
• Operating temperature: -20°C to 70°C
Packages
Type
IS1870
Note:
Pin Count
48
I/O Pins (up to)
31
Contact/Lead Pitch
0.4
Dimensions
6x6x0.9
Package
QFN48
All dimensions are in millimeters (mm) unless specified otherwise.
Applications
• Internet of Things (IoT)
• Wearable/Fitness/Healthcare
• Weight Scale
• Proximity/Find Me services
• Payment/Security
• Digital Beacons
• Consumer Appliances/Home Automation
• Industrial
IS1871
32
16
0.4
4x4x0.9
QFN32
2015 Microchip Technology Inc.
Preliminary
DS60001371B-Page 1


IS1870 Datasheet
Recommendation IS1870 Datasheet
Part IS1870
Description Bluetooth Low Energy (BLE) SoC
Feature IS1870; IS1870/71 Bluetooth® Low Energy (BLE) SoC Features • Bluetooth smart 4.2 Bluetooth Low-Energy (BLE.
Manufacture Microchip
Datasheet
Download IS1870 Datasheet




Microchip IS1870
IS1870/71
NOTES:
DS60001371B-Page 2
Preliminary
2015 Microchip Technology Inc.



Microchip IS1870
IS1870/71
Table of Contents
1.0 Device Overview ............................................................................................................................................................................. 5
2.0 System Block Details .................................................................................................................................................................... 13
3.0 Electrical Characteristics ............................................................................................................................................................... 17
4.0 Package Information ..................................................................................................................................................................... 23
5.0 Reflow Profile and Storage Condition ........................................................................................................................................... 29
6.0 Ordering Guide ............................................................................................................................................................................. 33
Appendix A: Reference Circuit ............................................................................................................................................................ 35
Appendix B: Layout Guidelines .......................................................................................................................................................... 37
Appendix C: Bill of Material ................................................................................................................................................................. 38
Appendix D: Revision History ............................................................................................................................................................. 39
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2015 Microchip Technology Inc.
Preliminary
DS60001371B-Page 3





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