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Headphone Driver. APA2176A Datasheet |
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![]() APA2176/2176A
270mW Stereo Cap-Free Headphone Driver
Features
• No Output Capacitor Required
• Dual Supply Voltage (PV >V )
DD DD
– VDD=1.8 ~5.5V
– PVDD=2.2 ~ 5.5V
• Meeting VISTA Requirements
• Output Power
at 1% THD+N
-200mW,
at
V =3.3V,
DD
PV =5.0V,
DD
RL=16Ω
-55mW,
at
V =1.8V,
DD
PV =3.0V,
DD
RL=16Ω
at 10% THD+N
-270mW, at VDD=3.3V, PVDD=5.0V, RL=16Ω
-70mW, at VDD=1.8V, PVDD=3.0V, RL=16Ω
• Less External Components Required
• High PSRR: 80dB at 217Hz
• Fast Start-Up Time : 120µs
• Short-Circuit and Thermal Protection
• Surface-Mount Package
– TQFN4x4-20B (with Enhanced Thermal Pad)
– TSSOP-16
– TQFN3x3-16 (with Enhanced Thermal Pad)
(for APA2176A)
• Lead Free and Green Devices Available
(RoHS Compliant)
Applications
• Headsets
• PDAs
• Portable Multimedia Devices
• Notebooks
General Description
The APA2176/2176A is a stereo, fixed gain, and cap-free
headphone driver which is available in TQFN4x4 20-pin,
TQFN3x3 16-pin (APA2176A) or TSSOP-16 package. Dual
supply voltage provides higher efficiency and better power
ripple rejection.
The APA2176/2176A is designed with ground-reference
output and no need the output capacitors for DC blocking.
The advantages of eliminating the output capacitor are
saving the cost, PCB’s space, and component height.
The built-in gain setting can minimize the external com-
ponent counts and save the PCB space. High PSRR pro-
vides increased immunity to noise and RF rectification. In
addition to these features, a fast start-up time and small
package size make the APA2176/2176A an ideal choice
for portable multimedia devices.
Moreover, the APA2176/2176A is also equipped other
features. For example, at THD+N=1%, it is capable of
driving 200mW at VDD=3.3V, PVDD=5.0V into 16Ω. In
addition, it provides thermal and short circuit protections.
Simplified Application Circuit
R-CH
RIN
Input
L-CH
Input
LIN
APA2176/2176A
RSD
Shutdown
Control LSD
Stereo
Headphone
ROUT
LOUT
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright © ANPEC Electronics Corp.
1
Rev. A.7 - Jan., 2013
www.anpec.com.tw
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![]() APA2176/2176A
Ordering and Marking Information
APA2176
APA2176A
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
QB : TQFN4x4-20B O : TSSOP-16
QB : TQFN3x3-16 (APA2176A)
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APA2176 QB :
APA2176
XXXXX
XXXXX - Date Code
APA2176 O :
APA2176
XXXXX
XXXXX - Date Code
APA2176A QB :
APA
2176A
XXXXX
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Pin Configuration
NC 16
GND 17
LSD 18
PVDD 19
NC 20
APA2176
10 VDD
9 LOUT
8 NC
7 VSS
6 NC
NC 13
GND 14
LSD 15
PVDD 16
APA2176A
8 VDD
7 LOUT
6 VSS
5 CVSS
TQFN4x4-20B (Top View)
TQFN3x3-16 (Top View)
=Thermal Pad (connected the Thermal Pad to ground plane for better heat dissipation)
NC 1
PVDD 2
NC 3
CP+ 4
PGND 5
CP- 6
CVSS 7
VSS 8
APA2176
16 LSD
15 GND
14 RIN
13 RSD
12 LIN
11 ROUT
10 VDD
9 LOUT
TSSOP-16 (Top View)
Copyright © ANPEC Electronics Corp.
2
Rev. A.7 - Jan., 2013
www.anpec.com.tw
|
![]() APA2176/2176A
Absolute Maximum Ratings (Note 1)
(Over operating free-air temperature range unless otherwise noted.)
Symbol
Parameter
Rating
Unit
VDD
Supply Voltage (VDD to GND)
-0.3 to 6
V
PVDD
Charge Pump Supply Voltage (PVDD to PGND)
-0.3 to 6
V
VPGND_GND PGND to GND Voltage
-0.3 to 0.3
V
VRSD, VLSD
VSS, CVSS
VROUT, VLOUT
Input Voltage (RSD and LSD to GND)
VSS and CVSS to GND and PGND Voltage
ROUT and LOUT to GND Voltage
-0.3 to VDD+0.3
V
-6 to 0.3
V
VSS-0.3 to VDD+0.3
V
VCP+
CP+ to PGND Voltage
-0.3 to PVDD+0.3
V
VCP-
TJ
TSTG
TSDR
CP- to PGND Voltage
Maximum Junction Temperature
Storage Temperature Range
Maximum Lead Soldering Temperature, 10 Seconds
CVSS-0.3 to 0.3
V
150
οC
-65 to +150
οC
260
οC
PD
Power Dissipation
Internally Limited
W
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability.
Thermal Characteristics (Note 2,3)
Symbol
Parameter
Typical Value
Unit
Junction-to-Ambient Resistance in Free Air
θJA
Junction-to-Case Resistance in Free Air
θJC
TQFN3x3-16
55
TQFN4x4-20B
43
TSSOP16
100
TQFN3x3-16
10
TQFN4x4-20B
8
oC/W
oC/W
Note 2: Please refer to “Thermal Pad Consideration”. 2 layered 5 in2 printed circuit boards with 2oz trace and copper through several
thermal vias. The thermal pad is soldered on the PCB.
Note 3: The case temperature is measured at the center of the exposed pad on the underside of the TQFN3x3-16 and TQFN4x4-20B
packages.
Recommended Operating Conditions (Note 4)
Symbol
Parameter
VDD
PVDD
Supply Voltage
Charge Pump Power Supply Voltage
VIH
High Level Threshold Voltage
VIL
Low Level Threshold Voltage
VICM
Common Mode Input Voltage
TA
Ambient Temperature
TJ
Junction Temperature
RL
Headphone Resistance
Note 4: Refer to the typical application circuit.
RSD, LSD
RSD, LSD
Range
1.8 ~ 5.5
2.2 ~ 5.5
0.6PVDD ~ PVDD
0 ~ 0.3PVDD
~ VDD-1
-40 ~ 85
-40 ~ 125
14 ~
Unit
V
V
V
V
V
oC
oC
Ω
Copyright © ANPEC Electronics Corp.
3
Rev. A.7 - Jan., 2013
www.anpec.com.tw
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