Layer Transceiver. KSZ8081MNX Datasheet

KSZ8081MNX Transceiver. Datasheet pdf. Equivalent

KSZ8081MNX Datasheet
Recommendation KSZ8081MNX Datasheet
Part KSZ8081MNX
Description 10Base-T/100Base-TX Physical Layer Transceiver
Feature KSZ8081MNX; KSZ8081MNX/KSZ8081RNB 10Base-T/100Base-TX Physical Layer Transceiver Revision 1.4 General Descripti.
Manufacture Micrel Semiconductor
Datasheet
Download KSZ8081MNX Datasheet




Micrel Semiconductor KSZ8081MNX
KSZ8081MNX/KSZ8081RNB
10Base-T/100Base-TX
Physical Layer Transceiver
Revision 1.4
General Description
The KSZ8081 is a single-supply 10Base-T/100Base-TX
Ethernet physical-layer transceiver for transmission and
reception of data over standard CAT-5 unshielded twisted
pair (UTP) cable.
The KSZ8081 is a highly-integrated PHY solution. It
reduces board cost and simplifies board layout by using
on-chip termination resistors for the differential pairs and
by integrating a low-noise regulator to supply the 1.2V
core.
The KSZ8081MNX offers the Media Independent Interface
(MII) and the KSZ8081RNB offers the Reduced Media
Independent Interface (RMII) for direct connection with
MII/RMII-compliant Ethernet MAC processors and
switches.
A 25MHz crystal is used to generate all required clocks,
including the 50MHz RMII reference clock output for the
KSZ8081RNB.
The KSZ8081 provides diagnostic features to facilitate
system bring-up and debugging in production testing and
in product deployment. Parametric NAND tree support
enables fault detection between KSZ8081 I/Os and the
board. Micrel LinkMD® TDR-based cable diagnostics
identify faulty copper cabling.
The KSZ8081MNX and KSZ8081RNB are available in 32-
pin, lead-free QFN packages (see “Ordering Information”).
Datasheets and support documentation are available on
website at: www.micrel.com.
Features
Single-chip 10Base-T/100Base-TX IEEE 802.3
compliant Ethernet transceiver
MII interface support (KSZ8081MNX)
RMII v1.2 Interface support with a 50MHz reference
clock output to MAC, and an option to input a 50MHz
reference clock (KSZ8081RNB)
Back-to-back mode support for a 100Mbps copper
repeater
MDC/MDIO management interface for PHY register
configuration
Programmable interrupt output
LED outputs for link, activity, and speed status indication
On-chip termination resistors for the differential pairs
Baseline wander correction
HP Auto MDI/MDI-X to reliably detect and correct
straight-through and crossover cable connections with
disable and enable option
Auto-negotiation to automatically select the highest link-
up speed (10/100Mbps) and duplex (half/full)
Power-down and power-saving modes
LinkMD TDR-based cable diagnostics to identify faulty
copper cabling
Parametric NAND Tree support for fault detection
between chip I/Os and the board
HBM ESD rating (6kV)
Functional Diagram
LinkMD is a registered trademark of Micrel, Inc.
Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
August 19, 2015
Revision 1.4



Micrel Semiconductor KSZ8081MNX
Micrel, Inc.
Features (Continued)
Loopback modes for diagnostics
Single 3.3V power supply with VDD I/O options for
1.8V, 2.5V, or 3.3V
Built-in 1.2V regulator for core
Available in 32-pin (5mm × 5mm) QFN package
Applications
Game console
IP phone
IP set-top box
IP TV
LOM
Printer
KSZ8081MNX/KSZ8081RNB
Ordering Information
Part Number
KSZ8081MNXCA
KSZ8081MNXIA(1)
Temperature
Range
0°C to +70°C
40°C to +85°C
Package
32-Pin QFN
32-Pin QFN
KSZ8081RNBCA
0°C to +70°C 32-Pin QFN
KSZ8081RNBIA(1)
40°C to +85°C 32-Pin QFN
KSZ8081MNX-EVAL
KSZ8081RNB-EVAL
Note:
1. Contact factory for lead time.
Lead
Finish
Pb-Free
Pb-Free
Pb-Free
Pb-Free
Description
MII, Commercial Temperature.
MII, Industrial Temperature.
RMII with 25MHz crystal/clock input and 50MHz
RMII REF_CLK output (power-up default),
Commercial Temperature.
RMII with 25MHz crystal/clock input and 50MHz
RMII REF_CLK output (power-up default),
Industrial Temperature.
KSZ8081MNX Evaluation Board
(Mounted with KSZ8081MNX device in commercial
temperature)
KSZ8081RNB Evaluation Board
(Mounted with KSZ8081RNB device in commercial
temperature)
August 19, 2015
2
Revision 1.4



Micrel Semiconductor KSZ8081MNX
Micrel, Inc.
KSZ8081MNX/KSZ8081RNB
Revision History
Revision
1.0
1.1
1.2
1.3
1.4
Date
11/5/12
2/6/14
12/18/14
04/14/15
08/19/15
Summary of Changes
Initial release of datasheet.
Removed copper wire bonding part numbers from Ordering Information.
Added note for TXC (Pin 22) and Register 16h, Bit [15] regarding a Reserved Factory Mode for
KSZ8081MNX device.
Corrected TXC (Pin 22) pin type for KSZ8081MNX device.
Removed TXC and RXC clock connections for MII Back-to-Back mode. This is a datasheet correction.
There is no change to the silicon.
Added series resistance and load capacitance for the crystal selection criteria.
Added silver wire bonding part numbers to Ordering Information.
Updated Ordering Information to include Ordering Part Number and Device Marking.
Updated Table 7, add a note for Table 7.
Updated Table 8, updated NAND tree I/O testing descriptions.
Add Max frequency for MDC in MII Management (MIIM) Interface section.
Updated Table 23, add a note for Table 23.
Updated Figure 22 and Figure 22 descriptions.
Updated descriptions under Figure 23 for LED strap pins, add a note for Figure 23.
Fixed the missing value for maximum junction and thermal resistance (θJC).
Updated descriptions in local loopback section for data loopback path.
Updated Table 17 and Table 21.
Updated Ordering Information Table.
Updated pin 22 TXC and register 16h bit [15] description for MNX part.
Updated description and add an equation in LinkMD section.
Add HBM ESD rating in Features.
August 19, 2015
3
Revision 1.4







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