Single-Chip Microcontroller. UPD70F3371A Datasheet

UPD70F3371A Microcontroller. Datasheet pdf. Equivalent

UPD70F3371A Datasheet
Recommendation UPD70F3371A Datasheet
Part UPD70F3371A
Description 32-bit Single-Chip Microcontroller
Feature UPD70F3371A; Data Sheet V850ES/FE3 32-bit Single-Chip Microcontroller Hardware µPD70F3370A(A) µPD70F3371(A) µPD70.
Manufacture NEC
Datasheet
Download UPD70F3371A Datasheet




NEC UPD70F3371A
Data Sheet
V850ES/FE3
32-bit Single-Chip Microcontroller
Hardware
µPD70F3370A(A) µPD70F3371(A)
µPD70F3370A(A1) µPD70F3371(A1)
µPD70F3370A(A2) µPD70F3371(A2)
Document No. U18564EE1V2DS00
Date Published March 2008
© NEC Electronics 2008
Printed in Germany



NEC UPD70F3371A
V850ES/FE3
Notes for CMOS Devices
1. Precaution against ESD for semiconductors
Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and
ultimately degrade the device operation. Steps must be taken to stop generation of static electricity
as much as possible, and quickly dissipate it once, when it has occurred. Environmental control
must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using
insulators that easily build static electricity. Semiconductor devices must be stored and transported
in an anti-static container, static shielding bag or conductive material. All test and measurement
tools including work bench and floor should be grounded. The operator should be grounded using
wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need
to be taken for PW boards with semiconductor devices on it.
2. Handling of unused input pins for CMOS
No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to
the input pins, it is possible that an internal input level may be generated due to noise, etc., hence
causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels
of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused
pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of
being an output pin. All handling related to the unused pins must be judged device by device and
related specifications governing the devices.
3. Status before initialization of MOS devices
Power-on does not necessarily define initial status of MOS device. Production process of MOS
does not define the initial operation status of the device. Immediately after the power source is
turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not
guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset
signal is received. Reset operation must be executed immediately after power-on for devices
having reset function.
2 Data Sheet U18564EE1V2DS00



NEC UPD70F3371A
V850ES/FE3
Legal Notes
• The information in this document is current as of January 2007. The information is subject to change
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licensed from Silicon Storage Technology, Inc.
Data Sheet U18564EE1V2DS00
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