YFZV36B Datasheet PDF | Rohm





(PDF) YFZV36B Datasheet PDF

Part Number YFZV36B
Description Zener Diode
Manufacture Rohm
Total Page 7 Pages
PDF Download Download YFZV36B Datasheet PDF

Features: Zener Diode YFZVFH series Datasheet Application Dimensions (Unit : mm ) AEC-Q101 Qualified Land size figu re (Unit : mm) Voltage regulation 1.4 0  0.10 0.17 0.10 0.05 1.1 2.00  0.10 2.50  0.20 0.8 0.5 2.0 Features 1) Small power mold type (TUMD2M) N6 2) High reliability 3) By chip-mouter, automatic mouting is poss ible. Construction Silicon epitaxial planar 0~ 0.10 TUMD2M 0.80  0. 05 0.20 0.600.10 ROHM : TUMD2M dot (year week factory)  day EX. YFZ VFH3.6B  Structure Taping di mensions (Unit : mm) Cathode Anode 4. 0±0.1 2.0±0.05 φ1.15.555±0.0 1.1       0 0.25±0.05 1.75 ±0.1 3.5±0.05 2.75 8.0±0.2 2.8±0.0 5 1.43±0.05 4.0±0.1 φ1.01.0 ±0.02.2      0 0.9±0.08 Absolute maximum ratings (Ta = 25°C) Parameter Symbol Limits Unit Powe r dissipation () P 500 mW Junction temperature Storage temperature Operat ing temperature Tj 150 Tstg 55 to 150 Topr 55 to 150 °C °C °C () Device mounted on glass-epoxy board(50×50mm, t=1.6mm) Solder land (10×10m.

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YFZV36B datasheet
Zener Diode
YFZVFH series
Datasheet
Application
Dimensions (Unit : mm)
AEC-Q101 Qualified
Land size figure (Unit : mm)
Voltage regulation
1.40 0.10
0.17 0.10
0.05
1.1
Features
1) Small power mold type (TUMD2M)
2) High reliability
3) By chip-mouter,
automatic mouting is possible.
Construction
Silicon epitaxial planar
0
0.10
TUMD2M
0.80 0.05
0.20
0.600.10
ROHM : TUMD2M
dot (year week factory) day
EX. YFZVFH3.6B
 Structure
Taping dimensions (Unit : mm)
Cathode
Anode
4.0±0.1 2.0±0.05
φ1.15.555±0.01.1
      0
0.25±0.05
1.43±0.05
4.0±0.1
φ1.01.0±0.02.2
     0
0.9±0.08
Absolute maximum ratings (Ta = 25°C)
Parameter
Symbol
Limits
Unit
Power dissipation ()
P 500 mW
Junction temperature
Storage temperature
Operating temperature
Tj 150
Tstg 55 to 150
Topr 55 to 150
°C
°C
°C
() Device mounted on glass-epoxy board(50×50mm, t=1.6mm) Solder land (10×10mm)
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1/6
2015.05 - Rev.B

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