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MAUC-011003

MA-COM
Part Number MAUC-011003
Manufacturer MA-COM
Description Up Converter
Published Sep 29, 2016
Detailed Description MAUC-011003 Up Converter 27.5 - 33.4 GHz Rev. V1 Features  Integrates Image Reject (Balanced) Mixer, LO Buffer, LO D...
Datasheet PDF File MAUC-011003 PDF File

MAUC-011003
MAUC-011003


Overview
MAUC-011003 Up Converter 27.
5 - 33.
4 GHz Rev.
V1 Features  Integrates Image Reject (Balanced) Mixer, LO Buffer, LO Doubler, and RF Buffer  12 dB Conversion Gain  20 dBm Input Third Order Intercept (IIP3)  -45 dBm (2x) LO Leakage (at RF Port)  Variable Gain with Adjustable Bias  Lead-Free 4 mm, 24 Lead QFN Package  RoHS^ Compliant and 260°C Reflow Compatible Description The MAUC-011003 is an integrated up-converter assembled in a lead-free 4 mm 24-lead PQFN plastic package.
This device has a typical conversion gain of 12 dB, and an image rejection of 15 dBc.
This up-converter includes a LO doubler, LO buffer amplifier, and RF buffer amplifier.
Variable gain can be achieved by adjusting the bias, with turn-down trajectories optimized to maintain linearity and 2LO leakage over the gain control range.
The output IP3 is 32 dBm at maximum gain.
The MAUC-011003 is ideally suited for 28 and 32 GHz band point-to-point radios under both LSB and USB operation and Ka-Band VSAT applications.
Each device is 100% RF tested to ensure performance compliance.
Ordering Information1 Part Number Package MAUC-011003-TR0500 500 Piece Reel MAUC-011003-001SMB Sample Board 1.
Reference Application Note M513 for reel size information.
Functional Schematic N/C N/C N/C GND RF GND 24 23 22 21 20 19 N/C 1 18 VD2 I* 2 17 VG2 I3 16 VD1 IRM Q4 15 VG1 Q* 5 14 VG4 N/C 6 X2 13 VD3 7 8 9 10 11 12 GND LO GND N/C N/C VG3 Pin Configuration2 Pin No.
Function Pin No.
Function 1 N/C 13 VD3 2 I* 14 VG4 3 I 15 VG1 4 Q 16 VD1 5 Q* 17 VG2 6 N/C 18 VD2 7 GND 19 GND 8 LO 20 RF 9 GND 21 GND 10 N/C 22 N/C 11 N/C 23 N/C 12 VG3 24 N/C 25 Paddle3 2.
For optimum RF performance, all N/C’s should be terminated to ground.
3.
The exposed pad centered on the package bottom must be connected to RF, DC and thermal ground.
1 ^ Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
M/A-COM Technology Solutions Inc.
(MACOM) and its affiliates reserve the r...



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