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GS832272C

GSI Technology
Part Number GS832272C
Manufacturer GSI Technology
Description 36Mb S/DCD Sync Burst SRAMs
Published Oct 14, 2016
Detailed Description Preliminary GS832218(B/E)/GS832236(B/E)/GS832272(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18,...
Datasheet PDF File GS832272C PDF File

GS832272C
GS832272C

Overview
Preliminary GS832218(B/E)/GS832236(B/E)/GS832272(C) 119-, 165-, & 209-Pin BGA Commercial Temp Industrial Temp 2M x 18, 1M x 36, 512K x 72 36Mb S/DCD Sync Burst SRAMs 250 MHz–133 MHz 2.
5 V or 3.
3 V VDD 2.
5 V or 3.
3 V I/O Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.
1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 2.
5 V +10%/–10% core power supply • 3.
3 V +10%/–10% core power supply • 2.
5 V or 3.
3 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Default to SCD x18/x36 Interleaved Pipeline mode • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 119-, 165-, and 209-bump BGA package Functional Description Applications The GS832218/36/72 is a 37,748,736-bit...


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