DatasheetsPDF.com

GS8662TT06BGD

GSI Technology
Part Number GS8662TT06BGD
Manufacturer GSI Technology
Description 72Mb SigmaDDR-II+ Burst of 2 SRAM
Published Oct 14, 2016
Detailed Description 165-Bump BGA Commercial Temp Industrial Temp GS8662TT20/38BD-550/500/450/400/350 GS8662TT06/11BD-500/450/400/350 72Mb ...
Datasheet PDF File GS8662TT06BGD PDF File

GS8662TT06BGD
GS8662TT06BGD

Overview
165-Bump BGA Commercial Temp Industrial Temp GS8662TT20/38BD-550/500/450/400/350 GS8662TT06/11BD-500/450/400/350 72Mb SigmaDDRTM-II+ Burst of 2 SRAM 550 MHz–350 MHz 1.
8 V VDD 1.
8 V or 1.
5 V I/O Features • 2.
5 Clock Latency • Simultaneous Read and Write SigmaDDRTM Interface • JEDEC-standard pinout and package • Double Data Rate interface • Byte Write controls sampled at data-in time • Burst of 2 Read and Write • Dual-Range On-Die Termination (ODT) on Data (D), Byte Write (BW), and Clock (K, K) inputs • 1.
8 V +100/–100 mV core power supply • 1.
5 V or 1.
8 V HSTL Interface • Pipelined read operation • Fully coherent read and write pipelines • ZQ pin for programmable output drive strength • Data Valid Pin (QVLD) Support • IEEE 1149.
1 JTAG-compliant Boundary Scan • 165-bump, 13 mm x 15 mm, 1 mm bump pitch BGA package • RoHS-compliant 165-bump BGA package available SigmaDDR-II™ Family Overview The GS8662TT06/11/20/38BD are built in compliance with the...


Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)