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THGBMDG5D1LBAIL

Part Number	THGBMDG5D1LBAIL
Manufacturer	Toshiba
Description	e-MMC Module
Published	Mar 8, 2018
Detailed Description	THGBMDG5D1LBAIL 4GB THGBMDG5D1LBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMDG5D1LBAIL is 4GB density of e-MMC Module...
Datasheet	THGBMDG5D1LBAIL PDF File

Overview

THGBMDG5D1LBAIL 4GB THGBMDG5D1LBAIL TOSHIBA e-MMC Module INTRODUCTION THGBMDG5D1LBAIL is 4GB density of e-MMC Module product housed in 153 ball BGA package.
This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module.
THGBMDG5D1LBAIL has an industry standard MMC protocol for easy use.
FEATURES THGBMDG5D1LBAIL Interface THGBMDG5D1LBAIL has the JEDEC/MMCA Version 5.
0 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection P-WFBGA153-1113-0.
50 (11.
5mm x 13mm, H0.
8mm max.
package) 14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC 11 NC NC NC NC NC ...

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THGBMDG5D1LBAIL e-MMC Module - Toshiba

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