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GS816273CC

GSI Technology
Part Number GS816273CC
Manufacturer GSI Technology
Description 18Mb S/DCD Sync Burst SRAMs
Published May 29, 2019
Detailed Description GS816273CC-333/300/250 209-Bump BGA Commercial Temp Industrial Temp 256K x 72 18Mb S/DCD Sync Burst SRAMs 333 MHz–250...
Datasheet PDF File GS816273CC PDF File

GS816273CC
GS816273CC

Overview
GS816273CC-333/300/250 209-Bump BGA Commercial Temp Industrial Temp 256K x 72 18Mb S/DCD Sync Burst SRAMs 333 MHz–250 MHz 3.
3 V or 2.
5 V VDD 3.
3 V or 2.
5 V I/O Features • Single/Dual Cycle Deselect selectable • IEEE 1149.
1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 3.
3 V or 2.
5 V core power supply • 3.
3 V or 2.
5 V I/O supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Default to SCD x18/x36 Interleaved Pipeline mode • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applications • JEDEC-standard 209-bump...


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