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MBRM120LT1G

ON Semiconductor
Part Number MBRM120LT1G
Manufacturer ON Semiconductor
Description Surface Mount Schottky Power Rectifier
Published Apr 1, 2020
Detailed Description MBRM120LT1G, NRVBM120LT1G, MBRM120LT3G, NRVBM120LT3G Surface Mount Schottky Power Rectifier POWERMITE Power Surface Mo...
Datasheet PDF File MBRM120LT1G PDF File

MBRM120LT1G
MBRM120LT1G

Overview
MBRM120LT1G, NRVBM120LT1G, MBRM120LT3G, NRVBM120LT3G Surface Mount Schottky Power Rectifier POWERMITE Power Surface Mount Package The Schottky POWERMITE employs the Schottky Barrier principle with a barrier metal and epitaxial construction that produces optimal forward voltage drop−reverse current tradeoff.
The advanced packaging techniques provide for a highly efficient micro miniature, space saving surface mount Rectifier.
With its unique heatsink design, the POWERMITE has the same thermal performance as the SMA while being 50% smaller in footprint area, and delivering one of the lowest height profiles,  1.
1 mm in the industry.
Because of its small size, it is ideal for use in portable and battery powered products such as cellular and cordless phones, chargers, notebook computers, printers, PDAs and PCMCIA cards.
Typical applications are AC−DC and DC−DC converters, reverse battery protection, and “ORing” of multiple supply voltages and any other application where performance and size are critical.
Features  Low Profile − Maximum Height of 1.
1 mm  Small Footprint − Footprint Area of 8.
45 mm2  Low VF Provides Higher Efficiency and Extends Battery Life  Supplied in 12 mm Tape and Reel  Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink  ESD Ratings:  Human Body Model = 3B (> 16 kV)  Machine Model = C (> 400 V)  AEC−Q101 Qualified and PPAP Capable  NRVB Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements  All Packages are Pb−Free* Mechanical Characteristics:  POWERMITE is JEDEC Registered as D0−216AA  Case: Molded Epoxy  Epoxy Meets UL 94 V−0 @ 0.
125 in  Weight: 16.
3 mg (Approximately)  Lead and Mounting Surface Temperature for Soldering Purposes: 260C Maximum for 10 Seconds *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
 Semiconductor C...


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