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WEDPNF8M721V-1210BC

Part Number	WEDPNF8M721V-1210BC
Manufacturer	ETC
Description	8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package
Published	Apr 17, 2005
Detailed Description	White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED*...
Datasheet	WEDPNF8M721V-1210BC PDF File

Overview

White Electronic Designs WEDPNF8M721V-XBX 8Mx72 Synchronous DRAM + 8Mb Flash Mixed Module Multi-Chip Package ADVANCED* FEATURES n n n Package: • 275 Plastic Ball Grid Array (PBGA), 32mm x 25mm Commercial, Industrial and Military Temperature Ranges Weight: • WEDPNF8M721V-XBX - 2.
5 grams typical n n n n Sector Architecture • One 16KByte, two 8KBytes, one 32KByte, and fif teen 64KBytes in byte mode • One 8K word, two 4K words, one 16K word, and fifteen 32K word sectors in word mode.
• Any combination of sectors can be concurrently erased.
Also supports full chip erase Boot Code Sector Architecture (Bottom) Embedded Erase and Program Algorithms Erase Suspend/Resume • Supports reading data from...

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