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DIP20

ETC
Part Number DIP20
Manufacturer ETC
Description Thermal Data
Published Jun 3, 2005
Detailed Description ® Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cm°C 0.01 W...
Datasheet PDF File DIP20 PDF File

DIP20
DIP20

Overview
® Thermal Data DIP 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.
61 W/cm°C 0.
01 W/cm°C leadframe die attach copper epoxy glue ( silver glue ) epoxy resin 0.
25 mm 10-40 µm molding compound 3 mm 0.
0063W/cm°C Typical assembly configuration before molding : Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data DIP 20 Rth(j-a) (ºC/W) 120 copper frame thickness = 0.
25 mm die pad = 125 x 160 sq.
mils die size = 10.
000 sq.
mils 1) 100 floating in air 80 mounted on board 60 0 0.
2 0.
4 0.
6 0.
8 1 1.
2 1.
4 1.
6 dissipated power ( Watt ) 1.
8 2 2.
2 2.
4 Transient Thermal Resista...


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